Datasheet > APD7720-230

APD7720-230

更新时间： 2024-01-02 00:37:55

品牌	Logo	应用领域
思佳讯 - SKYWORKS		衰减器二极管
页数	文件大小	规格书
3页	58K
描述
Pin Diode, Silicon, HERMETIC SEALED, CERAMIC, 230, 2 PIN

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APD7720-230 技术参数

是否无铅：	含铅	是否Rohs认证：	不符合
生命周期：	Obsolete	包装说明：	O-CRDB-F2
针数：	2	Reach Compliance Code：	unknown
HTS代码：	8541.10.00.80	风险等级：	5.92
其他特性：	HIGH RELIABILITY	应用：	ATTENUATOR
配置：	SINGLE	最大二极管电容：	0.45 pF
二极管元件材料：	SILICON	最大二极管正向电阻：	15 Ω
二极管类型：	PIN DIODE	JESD-30 代码：	O-CRDB-F2
少数载流子标称寿命：	3 µs	元件数量：	1
端子数量：	2	封装主体材料：	CERAMIC, METAL-SEALED COFIRED
封装形状：	ROUND	封装形式：	DISK BUTTON
峰值回流温度（摄氏度）：	NOT SPECIFIED	认证状态：	Not Qualified
表面贴装：	YES	技术：	POSITIVE-INTRINSIC-NEGATIVE
端子形式：	FLAT	端子位置：	RADIAL
处于峰值回流温度下的最长时间：	NOT SPECIFIED	Base Number Matches：	1

APD7720-230 数据手册

Silicon PIN Chip and Packaged Diodes

APD Series

Features

Switch and Attenuator Applications

Voltage Ratings to 1000 Volts

Low Rs and Low Capacitance Designs

Maximum Ratings

Surface Mount Microwave Packages

Tightly Controlled PIN Characteristics

For High Rel Applications

Storage Temperature:

–65°C to +200°C

Operating Temperature: –65°C to +175°C

Description

Alpha’s product line of silicon chip and packaged PIN

diodes are designed to cover a wide variety of

microwave and RF applications. The PIN designs have

been designated and characterized for fast speed

switches, low distortion attenuators and high RF

voltage applications. Alpha’s PIN semiconductor

materials and processing technology allows for a

superior combination of Rs, capacitance and voltage

ratings.

The packaged PIN diodes were selected as the most

commonly employed PIN diode chip designs in

standard packages. These designs are adaptable to

many RF and microwave requirements that utilize

packaged PIN diode components and are available

for quick delivery. All ceramic packaged PIN diodes

are hermetically sealed.

This product line of PIN diodes are designed to be

capable of meeting electrical and environmental

screening requirements of military and space

applications.

The PIN diode chip offering is specified for electrical

and physical parameters allowing designers of hybrid

circuits to be assured of consistent microwave and

geometric properties. All high voltage designs

incorporate glass passivation resulting in a reliable

low leakage current device.

Outline Dimensions

149–815

150 Series

Chip Size (In.)

Chip

Style

Bonding Pad

Nominal (In.)

METALIZED

GOLD DOT

Min.

Max.

150–801

150–802

150–804

150–806

150–813

.002 (min)

.008 (nom)

.0011 (min)

.002 (min)

.010

.016

.013

.010

.033

.014

.020

.015

.014

.035

SILICON

.004 – .006”

METALIZED BACK

CONTACT GOLD

Alpha Industries • [617] 935Ć5150 • Fax [617] 824Ć4579 • E-mail sales@alphaind.com • Visit our web site: www.alphaind.com

4–8

12 3

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