Datasheet > AP2302LM-

AP2302LM-

更新时间： 2024-02-29 15:48:08

品牌	Logo	应用领域
BCDSEMI		稳压器双倍数据速率
页数	文件大小	规格书
12页	131K
描述
2A DDR TERMINATION REGULATOR

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技术参数
数据手册

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AP2302LM- 技术参数

是否Rohs认证：	符合	生命周期：	Contact Manufacturer
包装说明：	SMALL OUTLINE, R-PDSO-G3	Reach Compliance Code：	compliant
ECCN代码：	EAR99	HTS代码：	8541.29.00.95
风险等级：	5.65	配置：	SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压：	20 V	最大漏源导通电阻：	0.064 Ω
FET 技术：	METAL-OXIDE SEMICONDUCTOR	JESD-30 代码：	R-PDSO-G3
湿度敏感等级：	1	元件数量：	1
端子数量：	3	工作模式：	ENHANCEMENT MODE
封装主体材料：	PLASTIC/EPOXY	封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE	峰值回流温度（摄氏度）：	260
极性/信道类型：	N-CHANNEL	表面贴装：	YES
端子形式：	GULL WING	端子位置：	DUAL
处于峰值回流温度下的最长时间：	40	晶体管应用：	SWITCHING
晶体管元件材料：	SILICON	Base Number Matches：	1

AP2302LM- 数据手册

Preliminary Datasheet

2A DDR TERMINATION REGULATOR

AP2302L

General Description

Features

Support Both DDR I (1.25V ) and DDR II

The AP2302L linear regulator is designed to meet the

JEDEC specification SSTL-2 and SSTL-18 for termi-

nation of DDR-SDRAM. The regulator can sink or

source up to 2A current continuously, providing

(0.9V ) Requirements

Source and Sink Current up to 2A

High Accuracy Output Voltage at Full-load

enough current for most DDR applications. V

OUT

Adjustable V

by External Resistors

OUT

designed to track the V

voltage within a ± 20mV

REF

Shutdown for Standby or Suspend Mode

Operation with High-impedance Output

tolerance over the entire current range while prevent-

ing shooting through on the output stage. On-chip ther-

mal limiting provides protection against a combination

of high current and ambient temperature which would

create an excessive junction temperature.

Applications

The AP2302L, used in conjunction with series termi-

nation resistors, provides an excellent voltage source

for active termination schemes of high speed transmis-

sion lines as those seen in high speed memory buses

and distributed backplane designs.

DDR-SDRAM Termination

DDR-II Termination

SSTL-2 Termination

The AP2302L is available in SOIC-8 and TO-252-5

packages.

TO-252-5

SOIC-8

Figure 1. Package Types of AP2302L

Nov. 2005 Rev. 1. 1

BCD Semiconductor Manufacturing Limited

12 3 4 5 6 7...12

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