AP10N012I
Halogen-Free Product
Advanced Power
Electronics Corp.
N-CHANNEL ENHANCEMENT MODE
POWER MOSFET
D
S
▼ 100% Rg & UIS Test
BVDSS
RDS(ON)
ID
100V
12.5mΩ
35.4A
▼ Simple Drive Requirement
▼ Lower On-resistance
G
▼ RoHS Compliant & Halogen-Free
Description
AP41600N401s2ersiersieasrearefrofrmomAAddvavannceceddPPoowweerriinnnnoovvaatteedd design
and silicon process technology to achieve the lowest possible
on-resistance and fast switching performance. It provides the
designer with an extreme efficient device for use in a wide
range of power applications.
G
D
TO-220CFM(I)
S
The TO-220 package is widely preferred for all commercial-
iTnhdeustrTiaOl-22th0rCouFgMh phaoclekageappilsicatwioindse.ly Tphreeferlroewd tfhoerrmaall
rceosmismtaenrcceiala-indulsotwriaplatchkraogueghcohsotleconatprpibliuctaetiotonst.he Twhoerldmwoidlde
pcompuplaorunpdacpkraogveid.es a high isolation voltage capability and low
thermal resistance between the tab and the external heat-sink.
Absolute Maximum Ratings@Tj=25oC(unless otherwise specified)
.
Symbol
Parameter
Rating
Units
V
VDS
VGS
Drain-Source Voltage
100
Gate-Source Voltage
+20
V
Drain Current, VGS @ 10V
Drain Current, VGS @ 10V
Pulsed Drain Current1
ID@TC=25℃
ID@TC=100℃
IDM
35.4
A
22.4
A
160
A
PD@TC=25℃
PD@TA=25℃
EAS
Total Power Dissipation
28.4
W
W
mJ
℃
℃
Total Power Dissipation
1.92
Single Pulse Avalanche Energy3
Storage Temperature Range
Operating Junction Temperature Range
128
TSTG
-55 to 150
-55 to 150
TJ
Thermal Data
Symbol
Parameter
Value
Units
℃/W
℃/W
Rthj-c
Maximum Thermal Resistance, Junction-case
Maximum Thermal Resistance, Junction-ambient
4.4
65
Rthj-a
1
201710171