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AP1098

更新时间: 2024-11-28 22:47:51
品牌 Logo 应用领域
其他 - ETC 放大器功率放大器
页数 文件大小 规格书
5页 106K
描述
2.4~2.5 GHz Power Amplifier

AP1098 数据手册

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AP1098  
2.4~2.5 GHz Power Amplifier  
2004.07.19 Preliminary  
Ultra LOW Current (see below specs)  
The AP1098 is a linear, low current power  
amplifier in ISM band utilizing InGaP /GaAs HBT  
process. It features a LOW current of 85mA,  
small signal gain of 25 dB, linear power of  
19dBm and PAE of 28% for 802.11g under 3.3V.  
It can also be adjusted to smaller current(~60mA)  
with lower linear power (~16dBm). The AP1098  
is housed in a 3 x 3 (mm), 16-pin, and QFN  
leadless package. The AP1098 is suitable to be  
used in portable, low current 802.11b and  
802.11g WLAN applications.  
Ultra High Efficiency:  
PAE>28% @802.11g linear power  
Gain: 25 dB  
Under Vc=3.3V, Vref=3V  
* 11g  
linear power: 19dBm  
current: 85mA  
* 11b  
linear power: 23dBm  
current: 165mA  
Low Idle Current: 25mA  
Pin Details  
Major Applications  
Pin Number  
Name  
Description  
RF input.  
• IEEE 802.11b/g WLAN system  
• WLAN Portable Devices  
• WLAN USB Devices  
• Bluetooth and other 2.4 GHz ISM  
Band Application  
1
2
3
RF_IN  
GND  
DC and RF ground.  
Supply voltage for bias circuit.  
Vcc_Bias  
4
Dect_Out  
Power detector output.  
5
6
7
Vb1  
Vb2  
1st-stage control voltage  
2nd-stage control voltage  
DC and RF ground.  
Functional Block Diagram  
NC  
16  
NC  
15  
Vcc1  
14  
Vcc1  
13  
GND  
8
NC  
NC  
No contact (Connect to ground for better  
thermal dissipation.)  
RF OUT  
RF OUT  
9
RF IN  
GND  
1
2
3
4
12  
11  
10  
9
10  
11  
12  
RF_OUT  
RF output. Require external matching.  
Input  
RF_OUT The detail configuration can be found in  
RF_OUT  
Match  
Application Notes  
Supply voltage for first stage. Some  
bypass capacitors are needed for  
system application. The detail  
configuration can be found in  
Application Notes.  
Vcc_Bias  
Dect_Out  
RF OUT  
NC  
Bias  
13  
VCC1  
Detector  
14  
VCC1  
5
6
7
8
Vb1  
Vb2  
GND  
NC  
15  
16  
NC  
NC  
No contact (Connect to ground for better  
thermal dissipation.)  
QFN- 16 pin, 3 x 3 (mm)  
The package ground provides circuit  
Center Metal ground as well as heat dissipation path  
for the power amplifier.  
Package  
Base  
Vb2 can be connected with Vb1 pin into a single Vref through external resistor. (Please refer to the AP1098 Application note)  
© 2003 RF Integrated Corporation. All rights reserved.  
For more information,please contact us at:  
Sales Dept.  
Tel: +886-2-2698-1022  
e-mail: sales@rfintc.com  
1 of 5  
RF integrated Corp. reserves the right to make any changes to the specifications without notice.  

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