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AOE6936 PDF预览

AOE6936

更新时间: 2024-11-07 01:11:23
品牌 Logo 应用领域
美国万代 - AOS /
页数 文件大小 规格书
2页 76K
描述
AOE6932 improves gate driving performance

AOE6936 数据手册

 浏览型号AOE6936的Datasheet PDF文件第2页 
Alpha and Omega Semiconductor  
475 Oakmead Parkway, Sunnyvale, California 94085 USA  
FOR IMMEDIATE RELEASE  
Media Contact: Mina Galvan  
Tel: 408.789.3233  
Email: mina.galvan@aosmd.com  
Alpha and Omega Semiconductor Expands Its New PairFET™ Family  
New PairFETTM series sets new industry standard with improved thermals and higher efficiency  
SUNNYVALE, Calif., Sep. 14, 2016 Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer,  
developer and global supplier of a broad range of power semiconductors and power ICs, today introduced two new products  
based on its high efficiency XS-PairFET package and latest low voltage technology. The AOE6932 and AOE6936 are the  
newest extensions to the flagship device, AOE6930, that was released in 2015. Both products are newly optimized for  
enhanced driving and switching performance.  
AOE6932 improves gate driving performance and reduces power loss at relatively low output current. AOE6936 features a  
20V gate voltage tolerance with much smaller parasitic capacitances. Both devices offer the same 8mohm (max) Rdson  
(@4.5V gate driving voltage) on the high side, but present different Rdson values for the low side FET. AOE6932 is  
designed with a 1.8mohm (max) @ 4.5Vgs low side FET, while AOE6936 is designed with a 3mohm (max) low side FET.  
Application tests show that these distinct configurations uniquely optimize each device to achieve the best efficiency and  
address specific application requirements, such as the input-output voltage headroom, and current per phase for the Vcore  
power supply.  
“Our first product packaged in a PairFET with a bottom-sourced low-side FET was released last year, and the AOE6930 is  
now widely accepted by leading customers in notebook PC, desktop PC, and high-end VGA designs. The benefits offered by  
this structure are significant. With direct thermal dissipation from the low side source down to the copper layer of the PCB,  
the temperature rise can be well controlled in the power device. With the newly released AOE6932 and AOE6936, we offer  
wide coverage of various application conditions, with optimal cost effectiveness. This product family is setting a new  
industry standard for high power density circuit design in all POL applications,” said Lei Feng, Sr. Marketing Director of  
MOSFET product line at AOS.  
Device Specification Table  
RDS(ON) (mΩ  
Part  
Number  
VGS  
(±V)  
VGS(th)  
(max V)  
Ciss  
(pF)  
Coss  
(pF)  
Crss  
(pF)  
Qg*  
(nC)  
Qgd  
(nC)  
max)* at VGS  
=
Package  
V
DS (V)  
10V  
5
4.5V  
8
High Side  
Low Side  
High Side  
Low Side  
High Side  
Low Side  
30  
30  
30  
30  
30  
30  
20  
12  
20  
20  
20  
12  
2.2  
1.9  
2.2  
2.1  
2.1  
1.9  
1150  
4180  
1150  
2270  
1075  
5560  
380  
880  
380  
650  
480  
1670  
55  
125  
55  
7.5  
30  
7.5  
15  
7
3
7
AOE6932  
AOE6936  
1.4  
5
1.8  
8
3
2
3
90  
4.5  
2.5  
12  
4.3  
7
55  
AOE6930  
(reference)  
0.83  
1.05  
200  
42  
Tel: 408.830.9742 Fax: 408.830.9757 www.aosmd.com  
1

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