AOT29S50/AOB29S50/AOTF29S50
500V 29A
α
MOS TM Power Transistor
General Description
Product Summary
VDS @ Tj,max
IDM
RDS(ON),max
Qg,typ
600V
The AOT29S50 & AOB29S50 & AOTF29S50 have been
fabricated using the advanced αMOSTM high voltage
process that is designed to deliver high levels of
performance and robustness in switching applications.
By providing low RDS(on), Qg and EOSS along with
guaranteed avalanche capability these parts can be
adopted quickly into new and existing offline power supply
designs.
120A
0.15Ω
26.6nC
6.3µJ
Eoss @ 400V
100% UIS Tested
100% Rg Tested
For Halogen Free add "L" suffix to part number:
AOT29S50L & AOB29S50L & AOTF29S50L
Top View
TO-263
D2PAK
TO-220
TO-220F
D
D
G
S
S
S
D
D
G
G
S
G
AOT29S50
AOTF29S50
AOB29S50
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
AOT29S50/AOB29S50 AOTF29S50
AOTF29S50L
Units
Drain-Source Voltage
VDS
500
V
Gate-Source Voltage
VGS
±30
V
A
TC=25°C
29
18
29*
18*
29*
18*
Continuous Drain
Current
ID
TC=100°C
Pulsed Drain Current C
Avalanche Current C
IDM
IAR
120
7.5
A
mJ
Repetitive avalanche energy C
Single pulsed avalanche energy G
TC=25°C
EAR
EAS
110
608
mJ
357
2.9
50
37.9
0.3
W
W/ oC
PD
Power Dissipation B
Derate above 25oC
0.4
100
20
MOSFET dv/dt ruggedness
dv/dt
V/ns
°C
Peak diode recovery dv/dt H
Junction and Storage Temperature Range
TJ, TSTG
-55 to 150
Maximum lead temperature for soldering
purpose, 1/8" from case for 5 seconds J
Thermal Characteristics
TL
300
°C
Parameter
Symbol
AOT29S50/AOB29S50 AOTF29S50
AOTF29S50L
Units
Maximum Junction-to-Ambient A,D
RθJA
65
65
65
°C/W
Maximum Case-to-sink A
RθCS
RθJC
0.5
--
--
°C/W
°C/W
Maximum Junction-to-Case
0.35
2.5
3.3
* Drain current limited by maximum junction temperature.
Rev0: March 2012
www.aosmd.com
Page 1 of 7