AOT12N50/AOB12N50/AOTF12N50
500V, 12A N-Channel MOSFET
General Description
Product Summary
VDS
600V@150℃
12A
The AOT12N50 & AOB12N50 & AOTF12N50 have been
fabricated using an advanced high voltage MOSFET
process that is designed to deliver high levels of
performance and robustness in popular AC-DC
applications.By providing low RDS(on), Ciss and Crss along
with guaranteed avalanche capability these parts can be
adopted quickly into new and existing offline power supply
designs.
ID (at VGS=10V)
RDS(ON) (at VGS=10V)
< 0.52Ω
100% UIS Tested
100% Rg Tested
For Halogen Free add "L" suffix to part number:
AOT12N50L & AOTF12N50L & AOB12N50L
Top View
TO-263
D2PAK
D
TO-220
TO-220F
D
G
S
S
S
S
D
D
G
G
G
AOT12N50
AOTF12N50
AOB12N50
Absolute Maximum Ratings TA=25°C unless otherwise noted
Parameter
Symbol
AOT12N50/AOB12N50
AOTF12N50
Units
Drain-Source Voltage
Gate-Source Voltage
VDS
500
V
V
VGS
±30
TC=25°C
12
12*
Continuous Drain
Current
ID
TC=100°C
8.4
8.4*
A
Pulsed Drain Current C
Avalanche Current C
Repetitive avalanche energy C
IDM
48
5.5
454
IAR
A
EAR
EAS
dv/dt
mJ
Single plused avalanche energy G
Peak diode recovery dv/dt
TC=25°C
908
mJ
V/ns
W
W/ oC
5
250
50
PD
Power Dissipation B
Derate above 25oC
2
0.4
Junction and Storage Temperature Range
Maximum lead temperature for soldering
purpose, 1/8" from case for 5 seconds
Thermal Characteristics
TJ, TSTG
TL
-55 to 150
°C
300
°C
Parameter
Symbol
AOT12N50/AOB12N50
AOTF12N50
Units
Maximum Junction-to-Ambient A,D
RθJA
65
65
°C/W
Maximum Case-to-sink A
RθCS
RθJC
0.5
0.5
--
°C/W
°C/W
Maximum Junction-to-Case
2.5
* Drain current limited by maximum junction temperature.
Rev7: Jul 2011
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