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AOB11S60 PDF预览

AOB11S60

更新时间: 2024-11-20 12:51:31
品牌 Logo 应用领域
美国万代 - AOS 晶体晶体管
页数 文件大小 规格书
6页 297K
描述
600V 11A a MOS Power Transistor

AOB11S60 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:SMALL OUTLINE, R-PSSO-G2Reach Compliance Code:compliant
风险等级:5.74雪崩能效等级(Eas):120 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:600 V最大漏极电流 (Abs) (ID):11 A
最大漏极电流 (ID):11 A最大漏源导通电阻:0.399 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-263AB
JESD-30 代码:R-PSSO-G2元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):178 W最大脉冲漏极电流 (IDM):45 A
子类别:FET General Purpose Powers表面贴装:YES
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

AOB11S60 数据手册

 浏览型号AOB11S60的Datasheet PDF文件第2页浏览型号AOB11S60的Datasheet PDF文件第3页浏览型号AOB11S60的Datasheet PDF文件第4页浏览型号AOB11S60的Datasheet PDF文件第5页浏览型号AOB11S60的Datasheet PDF文件第6页 
AOT11S60/AOB11S60/AOTF11S60  
600V 11A  
α
MOS TM Power Transistor  
General Description  
Product Summary  
VDS @ Tj,max  
IDM  
700V  
45A  
The AOT11S60& AOB11S60 & AOTF11S60 have been  
fabricated using the advanced αMOSTM high voltage  
process that is designed to deliver high levels of  
performance and robustness in switching applications.  
By providing low RDS(on), Qg and EOSS along with  
guaranteed avalanche capability these parts can be  
adopted quickly into new and existing offline power supply  
designs.  
RDS(ON),max  
Qg,typ  
0.399Ω  
11nC  
2.7µJ  
Eoss @ 400V  
100% UIS Tested  
100% Rg Tested  
For Halogen Free add "L" suffix to part number:  
AOT11S60L & AOB11S60L & AOTF11S60L  
Top View  
TO-220F(3kVAC;1s)  
TO-263  
D2PAK  
TO-220  
D
D
G
S
S
S
D
D
G
S
G
G
AOT11S60  
AOTF11S60  
AOB11S60  
Absolute Maximum Ratings TA=25°C unless otherwise noted  
Parameter  
Symbol  
AOT11S60/AOB11S60  
AOTF11S60  
Units  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
600  
V
V
VGS  
±30  
TC=25°C  
11  
8
11*  
8*  
Continuous Drain  
Current  
ID  
TC=100°C  
A
Pulsed Drain Current C  
Avalanche Current C  
IDM  
IAR  
45  
2
A
mJ  
Repetitive avalanche energy C  
Single pulsed avalanche energy G  
TC=25°C  
EAR  
EAS  
60  
120  
mJ  
W
W/ oC  
178  
38  
PD  
Power Dissipation B  
Derate above 25oC  
1.4  
100  
20  
0.3  
MOSFET dv/dt ruggedness  
Peak diode recovery dv/dt H  
dv/dt  
V/ns  
°C  
Junction and Storage Temperature Range  
TJ, TSTG  
-55 to 150  
Maximum lead temperature for soldering  
purpose, 1/8" from case for 5 seconds J  
Thermal Characteristics  
TL  
300  
°C  
Parameter  
Symbol  
AOT11S60/AOB11S60  
AOTF11S60  
Units  
Maximum Junction-to-Ambient A,D  
RθJA  
65  
65  
°C/W  
Maximum Case-to-sink A  
RθCS  
RθJC  
0.5  
0.7  
--  
°C/W  
°C/W  
Maximum Junction-to-Case  
3.25  
* Drain current limited by maximum junction temperature.  
Rev 5: Sep 2012  
www.aosmd.com  
Page 1 of 6  

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