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AND208SGA PDF预览

AND208SGA

更新时间: 2024-11-24 06:37:15
品牌 Logo 应用领域
PURDY /
页数 文件大小 规格书
3页 48K
描述
Standard Bright LED Lamps

AND208SGA 技术参数

生命周期:Contact ManufacturerReach Compliance Code:unknown
风险等级:5.77颜色@波长:Green/Red
最大正向电流:0.03 A最大正向电压:2.5 V
透镜类型:DIFFUSED最高工作温度:85 °C
最低工作温度:-40 °C总高度:9.7 mm
峰值波长:625 nm最大反向电压:5 V
子类别:Visible LEDs视角:110 deg
Base Number Matches:1

AND208SGA 数据手册

 浏览型号AND208SGA的Datasheet PDF文件第2页浏览型号AND208SGA的Datasheet PDF文件第3页 
AND208SGA  
Standard Bright LED Lamps  
Weight: 0.38 g  
4.0 0.2  
Unit: mm  
208S  
Product specifications contained herein may be changed without prior notice.  
It is therefore advisable to contact Purdy Electronics before proceeding with  
the design of equipment incorporating this product.  
AND208SGA  
Dual Color  
2mm x 5mm Rectangular  
5.0 0.2  
2.0 0.2  
4.0 0.2  
Features  
• All plastic mold type  
• Low drive current, (forward current = 10 – 15 mA)  
• Fast response time, capable of pulse operation  
• Viewing Angle: 110°  
RoHS Compliant  
Optical Characteristics (T = 25°C)  
Luminous Intensity  
2.0 Typ  
Red  
2.54 2.54  
Color  
@ 20 mA  
(mcd)  
Part  
Number  
Lens  
Desc.  
Source  
Green  
Emitting  
Lens  
White  
White  
Min.  
Typ.  
14  
GaAsP/GaP  
GaP  
Red  
Diffused  
Diffused  
8
8
AND208SGA  
Green  
14  
Absolute Maximum Ratings (T = 25°C)  
A
Rating  
Characteristics  
Symbol  
Unit  
GaAsP/GaP  
GaP  
(Green)  
(Red)  
Forward Current  
I
V
P
30  
25  
mA  
V
F
Reverse Voltage  
Power Dissipation  
5
105  
5
105  
R
Total Package  
D
T
T
Operating Temperature  
Storage Temperature Range  
-40 to +85  
-40 to +85  
°C  
°C  
Opr  
Stg  
Electro-Optical Characteristics (T = 25°C)  
A
Rating  
GaAsP/GaP  
(Red)  
GaP  
(Green)  
Characteristics  
Symbol  
Test Condition  
Unit  
Typ.  
2.0  
Max.  
2.5  
10  
Typ.  
2.2  
Max.  
2.5  
10  
V
I = 20mA  
Forward Voltage  
V
F
F
I
V = 5 V  
R
Reverse Current  
Peak Emission Wavelength  
Spectral Line Half Width  
µA  
nm  
nm  
R
I = 20mA  
λp  
λ
625  
45  
565  
30  
F
I = 20mA  
F
Precaution  
Please be careful of the following:  
1. Soldering temperature: 260°C max; Soldering time: 3 sec. max; Soldering portion of lead: up to 2 mm from the body of the device.  
2. The lead can be formed up to 5 mm from the body of the device without forming stress. Soldering should be performed after the  
lead forming.  
Purdy Electronics Corporation • 720 Palomar Avenue • Sunnyvale, CA 94085  
Tel:408.523.8200 • Fax:408.733.1287 • email@purdyelectronics.com • www.purdyelectronics.com  
7/18/07  

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