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AND116SG PDF预览

AND116SG

更新时间: 2024-11-20 06:37:15
品牌 Logo 应用领域
PURDY 光电光电器件
页数 文件大小 规格书
2页 45K
描述
Dual Color

AND116SG 技术参数

是否Rohs认证:符合生命周期:Contact Manufacturer
Reach Compliance Code:unknownHTS代码:8541.40.20.00
风险等级:5.58Is Samacsys:N
Base Number Matches:1

AND116SG 数据手册

 浏览型号AND116SG的Datasheet PDF文件第2页 
AND116SG  
Standard Bright LED Lamps  
Weight: 0.35 g  
Unit: mm  
Product specifications contained herein may be changed without prior notice.  
It is therefore advisable to contact Purdy Electronics before proceeding with the  
design of equipment incorporating this product.  
5.0  
AND116SG  
Dual Color  
T-1 3/4 (5mm)  
Features  
• Dual color: Red (GaAsP) / Green (GaP)  
• Common cathode  
0.5  
• All plastic mold type, milky diffused lens  
• Low drive current: 15 to 20 mA  
• Fast response time, capable of pulse operation  
RoHS Compliant  
Optical Characteristics (T = 25°C)  
a
2.54 2.54  
Cathode Index  
Axial Luminous  
Viewing  
Angle  
2θ1/2  
Test  
Color  
Intensity  
(mcd)  
Condition  
Lens Desc.  
(I –mA)  
F
(deg)  
1
2
3
LED  
Red  
Lens  
Min.  
Typ.  
12  
1. Anode (Green)  
2. Common  
Cathode  
Milky  
Milky  
Diffused  
Diffused  
10  
10  
20  
20  
70  
70  
Green  
12  
3. Anode (Red)  
Absolute Maximum Ratings (T = 25°C)  
a
Rating  
Characteristics  
Symbol  
Unit  
Red  
Green  
Forward Current  
I
25  
25  
mA  
F
V
Reverse Voltage  
Power Dissipation  
5
75  
5
75  
V
R
P
Total Package  
D
T
T
Operating Temperature  
Storage Temperature Range  
-25 to +85  
-25 to +100  
°C  
°C  
Opr  
Stg  
Electro-Optical Characteristics (T = 25°C)  
a
Red  
Green  
Characteristics  
Symbol  
Test Condition  
Unit  
Typ.  
2.1  
Max.  
3.0  
100  
Typ.  
2.1  
Max.  
3.0  
100  
V
I = 20mA  
Forward Voltage  
Reverse Current  
Peak Emission Wavelength  
Spectral Line Half Width  
V
F
F
I
V = 4 V  
R
µA  
nm  
nm  
R
I = 20mA  
λp  
λ
635  
40  
565  
25  
F
I = 20mA  
F
Precaution  
Please be careful of the following:  
1. Soldering temperature: 260°C max; Soldering time: 5 sec. max; Soldering portion of lead: up to 1.6 mm from the body of the device.  
2. The lead can be formed up to 5 mm from the body of the device without forming stress. Soldering should be performed after the  
lead forming.  
Purdy Electronics Corporation • 720 Palomar Avenue • Sunnyvale, CA 94085  
Tel:408.523.8200 • Fax:408.733.1287 • sales@purdyelectronics.com • www.purdyelectronics.com  
7/18/07  

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