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AND114GP PDF预览

AND114GP

更新时间: 2024-11-20 19:49:19
品牌 Logo 应用领域
PURDY 光电
页数 文件大小 规格书
2页 23K
描述
Single Color LED, Green, Diffused, T-1 3/4, 5mm, ROHS COMPLIANT, PLASTIC PACKAGE-2

AND114GP 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Contact Manufacturer包装说明:ROHS COMPLIANT, PLASTIC PACKAGE-2
Reach Compliance Code:unknownHTS代码:8541.40.20.00
风险等级:5.21颜色:GREEN
颜色@波长:Green配置:SINGLE
最大正向电流:0.025 A最大正向电压:2.8 V
透镜类型:DIFFUSED标称发光强度:18.0 mcd
安装特点:RADIAL MOUNT功能数量:1
端子数量:2最高工作温度:85 °C
最低工作温度:-40 °C光电设备类型:SINGLE COLOR LED
总高度:8.6 mm包装方法:BULK
峰值波长:565 nm形状:ROUND
尺寸:5 mm子类别:Visible LEDs
表面贴装:NOT代码:T-1 3/4
端子节距:2.54 mm视角:60 deg
Base Number Matches:1

AND114GP 数据手册

 浏览型号AND114GP的Datasheet PDF文件第2页 
AND114G/GP  
Standard Bright LED LAMPS  
Weight: 0:30 g  
Unit: mm  
AND114G  
AND114G/GP  
Standard LED  
ø5.0 ± 0.2  
T-1 3/4 Package (5 mm)  
Features  
Low power requirement  
Flush-mount  
All plastic molded lens  
Color: GaPGreen  
Cathode  
Index  
0.5  
Optical Characteristics (Ta = 25°C)  
2.54  
Cathode Index  
Axial Luminous  
Intensity (mcd)  
Viewing  
Angle  
2θ1/2  
Test  
Condition  
Color  
Lens  
Desc.  
1
2
1. Anode  
2. Cathode  
(I –mA)  
F
LED  
Lens  
Min.  
Typ.  
(deg)  
AND114GP  
Green  
Green  
Diffused  
5
18  
10  
60  
Absolute Maximum Ratings (Ta = 25°C)  
ø5.0 ± 0.2  
Rating  
(Yellow)  
Characteristics  
Symbol  
Unit  
I
25  
5
mA  
V
Forward Current (DC)  
Reverse Voltage  
F
V
R
P
105  
mW  
°C  
Power Dissipation  
D
0.5  
T
-40 to +85  
-40 to +85  
Operating Temperature  
Storage Temperature Range  
Opr  
T
°C  
Stg  
2.54  
Cathode Index  
1
2
1. Anode  
2. Cathode  
Electro-Optical Characteristics (Ta = 25°C)  
Yellow  
Typ.  
2.1  
Characteristics  
Symbol  
Test Condition  
Min.  
Unit  
Max.  
2.5  
10  
V
I = 20mA  
F
V
Forward Voltage  
F
I
V = 5 V  
R
µA  
nm  
nm  
Reverse Current  
R
I = 15mA  
λp  
565  
30  
Peak Emission Wavelength  
Spectral Line Half Width  
F
I = 15mA  
λ
F
Precaution  
Please be careful of the following:  
1. Soldering temperature: 260°C max; Soldering time: 5 sec. max; Soldering portion of lead: up to 1.6 mm from the  
body of the device.  
2. The lead can be formed up to 5 mm from the body of the device without forming stress. Soldering should be  
performed after the lead forming.  
Purdy Electronics Corporation • 720 Palomar Avenue • Sunnyvale, CA 94086  
4/7/00  
Tel:408.523.8200 • Fax:408.733.1287 • email@purdyelectronics.com  
1
www.purdyelectronics.com  

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