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AND113G PDF预览

AND113G

更新时间: 2024-11-20 06:37:15
品牌 Logo 应用领域
PURDY /
页数 文件大小 规格书
2页 86K
描述
Standard LED

AND113G 技术参数

生命周期:Contact ManufacturerReach Compliance Code:unknown
HTS代码:8541.40.20.00风险等级:5.57
颜色@波长:Green最大正向电流:0.025 A
最大正向电压:2.8 V透镜类型:TRANSPARENT
最高工作温度:75 °C最低工作温度:-25 °C
总高度:8.6 mm峰值波长:565 nm
子类别:Visible LEDs视角:50 deg
Base Number Matches:1

AND113G 数据手册

 浏览型号AND113G的Datasheet PDF文件第2页 
AND113G/GP Standard LED  
Standard Bright LED LAMPS  
Weight: 0:30 g  
Unit: mm  
Product specifications contained herein may be changed without prior notice.  
It is therefore advisable to contact Purdy Electronics before proceeding with  
the design of equipment incorporating this product.  
AND113G  
ø5.0 0.2  
AND113G/GP  
Standard LED  
T-1 3/4 Package (5 mm)  
Cathode  
Index  
0.5  
Features  
• RoHS Compliant  
• Low power requirement  
• Flush-mount  
• All plastic molded lens  
• Color: GaP–Green  
2.54  
Cathode Index  
1
2
1. Anode  
2. Cathode  
Optical Characteristics (Ta = 25°C)  
AND113GP  
Axial Luminous  
Intensity (mcd)  
Viewing  
Angle  
2θ1/2  
Test  
Color  
Lens  
Desc.  
Condition  
(I –mA)  
F
LED  
Lens  
Min.  
Typ.  
ø5.0 0.2  
(deg)  
Green  
Clear  
20  
50  
10  
30  
Green  
Absolute Maximum Ratings (Ta = 25°C)  
Rating  
(Yellow)  
Characteristics  
Symbol  
Unit  
0.5  
I
25  
mA  
V
Forward Current (DC)  
Reverse Voltage  
F
V
5
R
P
2.54  
Power Dissipation  
Operating Temperature  
Storage Temperature Range  
105  
mW  
°C  
D
Cathode Index  
1. Anode  
T
-40 to +85  
-40 to +85  
Opr  
1
2
T
°C  
Stg  
2. Cathode  
Electro-Optical Characteristics (Ta = 25°C)  
Yellow  
Typ.  
2.1  
Characteristics  
Symbol  
Test Condition  
Min.  
Unit  
Max.  
2.5  
10  
V
I = 20mA  
F
V
Forward Voltage  
Reverse Current  
Peak Emission Wavelength  
Spectral Line Half Width  
F
I
V = 5 V  
R
µA  
nm  
nm  
R
I = 15mA  
λp  
565  
30  
F
I = 15mA  
λ
F
Precaution  
Please be careful of the following:  
1. Soldering temperature: 260°C max; Soldering time: 5 sec. max; Soldering portion of lead: up to 1.6 mm from the  
body of the device.  
2. The lead can be formed up to 5 mm from the body of the device without forming stress. Soldering should be  
performed after the lead forming.  
Purdy Electronics Corporation • 720 Palomar Avenue • Sunnyvale, CA 94085  
7/18/07  
Tel:408.523.8200 • Fax:408.733.1287 • sales@purdyelectronics.com  
1
www.purdyelectronics.com  

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