Model 1M803S
Rev. C
Micro Xinger
3dB Hybrid Coupler
Description
The 1M803S Micro Xinger® is a low profile, miniature 3dB hybrid coupler in
an easy to use surface mount package designed for U-NII, ISM and
hyperLAN applications. The 1M803S is designed for balanced amplifiers
and signal distribution and is an ideal solution for the ever increasing
demands of the wireless industry for smaller printed circuit boards and high
performance. Parts have been subjected to rigorous qualification testing
and units are 100% tested. They are manufactured using materials with x
and y thermal expansion coefficients compatible with common substrates
such as FR4 and G-10. Produced with 6 of 6 RoHS compliant tin
immersion.
ELECTRICAL SPECIFICATIONS**
Insertion
Loss
Features:
Frequency
Isolation
VSWR
• 5.0 – 6.0 GHz
• Very Low Loss
• High Isolation
GHz
dB Min
dB Max
Max:1
5.0 – 6.0
20
0.25
1.21
o
• 90 Quadrature
Amplitude
Balance
Phase
Balance
Operating
Temp.
• Surface Mountable
• Tape And Reel
• New Micro-Package
• 100% Tested
Power
ΘJC
Ave. CW
Watts
dB Max
Degrees
ºC/Watt
ºC
± 0.30
± 3
20
78.1
-55 to +85
• Lead Free
**Specification based on performance of unit properly installed on microstrip printed circuit
boards with 50 Ω nominal impedance. Specifications subject to change without notice.
Mechanical Outline
±.007
.065
±0.18
[1.66
]
±.010
±.004
.400
4X .024
[0.61
Pin 2
±0.25
±0.10
[10.16
]
]
Pin 1
Pin 4
GND
±.00
±0.
4X .048
±.010
.200
[1.22
±0.25
[5.08
]
±.004
.104
±0.10
[2.64
]
±.004
±0.10
.304
[7.72
Denotes
Array Number
GND
Pin 3
]
es [Millimeters]
Dimensions are in Inch
al Outline
1M803S Mechanic
Tole
rances are Non-Cumulative
USA/Canada:
Toll Free:
(315) 432-8909
(800) 544-2414
+44 2392-232392
Available on Tape
and Reel For Pick and
Place Manufacturing.
Europe: