Datasheet > AN4869

AN4869

更新时间： 2024-11-13 22:05:43

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Power Assemblies

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AN4869 数据手册

Heatsinks

HEATSINKS

Power Assemblies

DS5404-1.0 November 2000

The current range of heatsinks is illustrated with a brief

resumé of their characteristics. The products available are

intended for use with all our power semiconductors - from

the small stud base through to large disc devices and

modules.

All heatsinks are suitable for Natural Air Cooling (AN) and

Forced Air Cooling (FC). In addition to a vast experience of

AN and FC cooling methods we also have many years

experience in liquid and phase change cooling.

A range of coolers for 17mm to 100mm silicon diameter

devices is available, as is a range of associated clamps.

AIR COOLED HEATSINKS

All dimensions shown in mm unless stated otherwise.

0.5

0.15

0.48

0.145

0.46

0.44

0.14

0.42

0.4

0.135

0.38

0.13

0.36

0.34

0.32

M8 slots

175

200W

Cross sectional area (cm²): 52.3

Weight kg/m: 141.2

0.125

200W

0.3

125 175 225 275 325 375

0.12

125 165 205 245 285

HEATSINK LENGTH (mm)

Air natural

Forced air (5m/s)

Heatsink profile: ED

0.1

0.095

0.09

0.44

0.42

0.4

M6 slot

222 ± 1

0.38

0.36

0.34

0.32

0.3

0.085

0.08

200W

200 W

Cross sectional area (cm²): 124.08

Weight kg/m: 31

0.075

125 175 225 275 325 375

HEATSINK LENGTH (mm)

Air natural

Forced air (5m/s)

Heatsink profile: EM

1/5

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