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AN4505 PDF预览

AN4505

更新时间: 2024-11-13 22:05:43
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DYNEX /
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5页 119K
描述
Power Assemblies

AN4505 数据手册

 浏览型号AN4505的Datasheet PDF文件第2页浏览型号AN4505的Datasheet PDF文件第3页浏览型号AN4505的Datasheet PDF文件第4页浏览型号AN4505的Datasheet PDF文件第5页 
HEATSINKS  
Power Assemblies  
DS5404-1.0 November 2000  
The current range of heatsinks is illustrated with a brief  
resumé of their characteristics. The products available are  
intended for use with all our power semiconductors - from  
the small stud base through to large disc devices and  
modules.  
All heatsinks are suitable for Natural Air Cooling (AN) and  
Forced Air Cooling (FC). In addition to a vast experience of  
AN and FC cooling methods we also have many years  
experience in liquid and phase change cooling.  
A range of coolers for 17mm to 100mm silicon diameter  
devices is available, as is a range of associated clamps.  
AIR COOLED HEATSINKS  
All dimensions shown in mm unless stated otherwise.  
0.5  
0.15  
0.48  
0.145  
0.46  
0.44  
0.14  
0.42  
0.4  
0.135  
0.38  
0.13  
27  
0.36  
0.34  
0.32  
M8 slots  
175  
200W  
Cross sectional area (cm2): 52.3  
Weight kg/m: 141.2  
0.125  
200W  
0.3  
125 175 225 275 325 375  
0.12  
125 165 205 245 285  
HEATSINK LENGTH (mm)  
HEATSINK LENGTH (mm)  
Air natural  
Forced air (5m/s)  
Heatsink profile: ED  
0.1  
0.095  
0.09  
0.44  
0.42  
0.4  
M6 slot  
222 ± 1  
0.38  
0.36  
0.34  
0.32  
0.3  
0.085  
0.08  
50  
200W  
200 W  
Cross sectional area (cm2): 124.08  
Weight kg/m: 31  
0.075  
125 175 225 275 325 375  
125 175 225 275 325 375  
HEATSINK LENGTH (mm)  
HEATSINK LENGTH (mm)  
Air natural  
Forced air (5m/s)  
Heatsink profile: EM  
1/5  
www.dynexsemi.com  

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