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AN1024

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GSI ECCRAMs?—The Benefits of On-Chip ECC

AN1024 数据手册

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Preliminary  
AN1024  
GSI ECCRAMsTM  
The Benefits of On-Chip ECC  
The ECC implementation is entirely transparent to the user.  
Type II and II+ ECCRAMs are fully compatible with other  
Type II and II+ SigmaQuad and SigmaDDR SRAMs, except  
with respect to Byte Write support. See Byte Write  
Implications below for further information.  
Introduction  
Error Correction Code, or ECC, is commonly utilized with  
SRAMs in applications where data corruption via SER events  
is not easily tolerated. Typically, the ECC algorithms detect  
and correct single-bit data errors. In some instances they can  
also detect multi-bit errors, depending on the type of algorithm  
used and the number of parity bits allocated to ECC.  
Applications  
The primary applications for ECCRAMs are those that demand  
a very high level of dependability, such as military and other  
data-critical applications, as well as those that are more  
susceptible to SER events, such as aerospace, satellite, and  
other applications expected to be utilized at high-altitude.  
Traditionally, in environments that require high data integrity,  
the ECC error detection and correction algorithms have been  
implemented in custom ASIC- and FPGA-based memory  
controllers. However, it has become increasingly rare for such  
controllers to be designed in-house, due to cost, resource, and  
time-to-market constraints. Unfortunately, the availability of  
3rd party, off-the-shelf SRAM controllers designed for the  
commercial market is quite limited, and those that are available  
often do not support ECC functionality, leaving SER-sensitive  
SRAM users in a difficult situation.  
Benefits  
• Virtually Zero Soft Error Rate (SER)  
Accelerated SER testing has been conducted on 72Mb  
ECCRAMs at the LANSCE WNR facility in Los Alamos,  
NM. The following table presents the nominal cosmic ray  
FIT for each event type (SBU, MCU, SEFI, SEL) for the  
tested devices at sea level New York City. FIT rate values  
Bringing the ECC on-chip resolves the issue by removing the  
burden from the controller, thereby simplifying custom  
9
are per Mbit per 10 hours, and represent 95% confidence  
rd  
controller design and maximizing 3 party controller options  
level.  
for the application. It also provides utilization efficiency  
benefits that are explained further below.  
Cosmic Ray FIT Values at Sea Level, New York City  
Accordingly, GSI Technology has developed a family of  
SigmaQuad™ and SigmaDDR™ SRAMs with on-chip ECC,  
referred to collectively as “ECCRAMs”.  
1
2
3
4
5
Test  
SEU  
FIT  
SBU  
FIT  
MCU  
FIT  
SEF  
FIT  
SEL  
FIT  
Condition  
ECC  
Disabled  
567  
0
305  
0
262  
0
0
0
0
0
Implementation  
GSI ECCRAMs utilize a single-bit error detection and  
correction Hamming Code algorithm. The ECC is implemented  
independently on each external 9-bit data bus, across the entire  
18-bit DDR data word transmitted on the bus. For example,  
x36 devices have four such 9-bit busses, and x18 devices have  
two such 9-bit busses.  
ECC  
Enabled  
Notes:  
1. SEU = Single-Event Upset (SBU + MCU)  
2. SBU = Single-Bit Upset  
3. MCU = Multi-Cell Upset  
4. SEFI = Single-Event Functional Interrupt  
5. SEL = Single-Event Latch-up  
Five ECC parity bits (invisible to the user) are utilized per 18  
data bits (visible to the user). Consequently, 72Mb ECCRAMs  
(for example) are actually 92Mb devices, with 72Mb visible  
and available to the user.  
With ECC disabled, the total SEU FIT rate was 567,  
comprising an SBU FIT rate of 305 and a MCU FIT rate  
of 262.  
The ECC algorithm neither corrects nor detects multi-bit  
errors. However, the ECCRAMs are architected in such a way  
that a single SER event very rarely causes a multi-bit error  
across any given “data word”, where a “data word” in this  
context represents the data transmitted as the result of a single  
read or write operation to a particular address.  
With ECC enabled, the total SEU FIT rate decreased to 0,  
indicating that all SBUs and MCUs that occurred during  
the testing were corrected by the ECC. Which indicates  
that none of the MCUs that occurred during the testing  
Rev: 1.00 11/2012  
1/3  
© 2012, GSI Technology  
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.  

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