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ANꢀ9072
Smart Power Module MotionꢀSPM™ in ꢁMiniꢀDIP SPM
Mounting Guidance
Mounting Guidance
This application note shows the electric spacing and
mounting guidance of ꢀMiniꢁDIP SPM.
Electric Spacing
The electric spacing specification of ꢀMiniꢁDIP SPM is
shown in Table 1.
Table 1. Typical Electric Spacing of ꢂMiniꢀDIP SPM
Creepage
Clearance
Distance
[mm]
[mm]
Between Power Terminals
Between Control Terminals
Between Terminals & Heat Sink
3.08
2.35
2.05
3.28
4.95
2.05
Figure 1. Mounting Screws Fastening Order:
PreꢀScrewing: 1 → 2; Final Screwing: 2 → 1
Notes:
1. Do not over torque when mounting screws. Excess
mounting torque may cause ceramic cracks, as well as
screw and heat-sink damage.
2. Avoid one-side tightening stress, Figure 1 shows the
recommended torque order for mounting screws.
Uneven mounting can cause the SPM ceramic
substrate to be damaged. The pre-screwing torque is
set to 20~30% of maximum torque rating.
Mounting Method and Precautions
When installing a module to a heat sink, excessive uneven
fastening force might apply stress to inside chips, which can
lead to damage or degradation of the device. An example of
recommended fastening order is shown in Figure 1.
Table 2. Mounting Torque and Heat Sink Flatness Specifications
Limits
Typ.
Parameter
Conditions
Units
Min.
Max.
Device Flatness
See Figure 2
See Figure 3
0
+120
+100
0.8
µm
µm
Heat Sink Flatness
-50
0.6
6.2
Recommended 0.7N·m
Recommended 7.1kg·m
0.7
7.1
11
N·m
kg·cm
g
Mounting Torque
Screw: M3
8.1
Weight
Note:
3. Recommend using SEMS screw (include spring/plain washer, M3) in fastening screws.
© 2009 Fairchild Semiconductor Corporation
Rev. 1.0.2 • 4/7/11
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