Datasheet > AN-9048

AN-9048

更新时间： 2024-11-13 08:30:43

品牌	Logo	应用领域
飞兆/仙童 - FAIRCHILD		/
页数	文件大小	规格书
9页	750K
描述
6x6 DriverMOS Packaging

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AN-9048 数据手册

AN-9048

Assembly Guidelines for Fairchild’s 6x6 DriverMOS Packaging

By Dennis Lang

These three pads are the high and low side

MOSFETs and the driver. The 6x6 DriverMOS is

designed to be used in high current synchronous

buck DC-DC circuits, saving board space and

component count by integrating several functions

into one package.

INTRODUCTION

The Fairchild 6x6 DriverMOS package is based on

Molded Leadless Packaging (MLP) technology.

This technology has been increasingly used in

packaging for power related products due to its

low package height, excellent thermal performance

with large thermal pads in the center of the

package which solder directly to the printed wiring

board (PWB) and allow modularity in package

design, single and multi-die packages are within the

capability of MLP technology.

This application note focuses on the soldering and

back end processing of the 6x6 DriverMOS.

Circuit design considerations will be addressed in

another application note.

BOARD MOUNTING

The 6x6 DriverMOS has three large die attach

pads allowing direct soldering to the PWB for best

thermal and electrical performance.

The solder joint and pad design are the most

important factors in creating a reliable assembly.

The pad must be designed to the proper

dimensions to allow for tolerances in PWB

fabrication and pick and place, and also to allow

for proper solder fillet formation where applicable.

MLP packages, when the pre-plated lead-frame is

sawn, show bare copper on the end of the exposed

side leads. This is normal, and is addressed by IPC

JEDEC J-STD-001C “Bottom Only Termination”.

However, it has been found that optimized PWB

pad design and a robust solder process will

typically yield solder fillets to the ends of the lead

due to the cleaning action of the flux in the solder

paste.

PWB DESIGN CONSIDERATIONS

Any land pad pattern must take into account the

various tolerances involved in production of the

PWB and the assembly operations required for

soldering the DrMOS to the PWB. These factors

have already been taken into consideration on the

Figure 1: Bottom side view showing pads for 6x6

DriverMOS

12 3 4 5 6 7...9

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