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AN-9046

更新时间： 2024-11-13 08:30:43

品牌	Logo	应用领域
飞兆/仙童 - FAIRCHILD		/
页数	文件大小	规格书
10页	854K
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Dual Power56 Packaging

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AN-9046 数据手册

Application Note AN9046

Assembly Guidelines for Dual Power56 Packaging

By Dennis Lang

This application note focuses on the soldering and

back end processing of the Dual Power56.

INTRODUCTION

The Fairchild^®Dual Power56 package is based on

Molded Leadless Packaging (MLP) technology.

This technology has been increasingly used in

packaging for power related products due to its

low package height, excellent thermal performance

with large thermal pads in the center of the

package which solder directly to the printed wiring

board (PWB). Modularity in package design,

single and multi-die packages, is within the

capability of MLP technology.

BOARD MOUNTING

The solder joint and pad design are the most

important factors in creating a reliable assembly.

The pad dimensions must be designed to allow for

tolerances in PWB fabrication and pick and place,

which are necessary for proper solder fillet

formation. MLP packages, when the pre-plated

lead-frame is sawn, show bare copper on the end

of the exposed edge leads. This is normal, and is

addressed by IPC JEDEC J-STD-001C “Bottom

Only Termination”. In practice it has been found

that optimized PWB pad design and a robust

solder process often yields solder fillets to the ends

of the lead due to the cleaning action of the flux in

the solder paste.

The Dual Power56 has two large die attach pads

allowing direct soldering to the PWB for best

thermal and electrical performance. These two

pads are the co-packaged high and low side

MOSFETs. The Dual Power56 is designed to be

used in high current synchronous buck DC-DC

circuits, saving board space and component count

by integrating the high and low side MOSFETs

into one package.

Figure 2: Exposed copper on package edge, with

solder wetting after reflow, from singulation

process.

PWB DESIGN CONSIDERATIONS

Any land pad pattern must take into account the

various PWB and board assembly tolerances for

successful soldering of the MLP to the PWB.

These factors have already been considered for the

recommended footprint given on the datasheet. It

Figure 1: Bottom side view showing pads for Dual

Power56.

12 3 4 5 6 7...10

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