5秒后页面跳转
AN-1026 PDF预览

AN-1026

更新时间: 2024-10-29 08:30:39
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
12页 223K
描述
Maximum Power Enhancement Techniques for SuperSOTTM-6 Power MOSFETs

AN-1026 数据手册

 浏览型号AN-1026的Datasheet PDF文件第2页浏览型号AN-1026的Datasheet PDF文件第3页浏览型号AN-1026的Datasheet PDF文件第4页浏览型号AN-1026的Datasheet PDF文件第5页浏览型号AN-1026的Datasheet PDF文件第6页浏览型号AN-1026的Datasheet PDF文件第7页 
AN1026  
April, 1996  
Maximum Power Enhancement Techniques for SuperSOTTM-6 Power  
MOSFETs  
Alan Li, Brij Mohan, Steve Sapp, Izak Bencuya, Linh Hong  
1. Introduction  
As packages become smaller, achieving efficient thermal performance for power applications re-  
quires that the designers employ new methods of meliorating the heat flow out of devices. Thus  
the purpose of this paper is to aid the user in maximizing the power handling capability of the  
SuperSOTTM-6 Power MOSFET offered by Fairchild Semiconductor. This effort allows the user to  
take full advantage of the exceptional performance features of Fairchild’s state-of-the-art Power  
MOSFET which offers very low on-resistance and improved junction-to-case (RθJC) thermal resis-  
tance. Ultimately the user may achieve improved component performance and higher circuit board  
packing density by using the thermal solution suggested below.  
In natural cooling, the method of improving power performance should be focused on the optimum  
design of copper mounting pads. The design should take into consideration the size of the copper  
and its placement on either or both of the board surfaces. A copper mounting pad is important  
because the drain leads of the Power MOSFET are mounted directly onto the pad. The pad acts  
as a heatsink to reduce thermal resistance and leads to improved power performance.  
S
D2  
S1  
D
D1  
D
G
G2  
D
S2  
D
G1  
Figure 1. SuperSOTTM-6 Power MOSFET achieves junction-to-case thermal resistance RθJC of 30oC/W  
for single device and 60oC/W for dual devices.  
2. Theory  
When a device operates in a system under the steady-state condition, the maximum power  
dissipation is determined by the maximum junction temperature rating, the ambient temperature,  
and the junction-to-ambient thermal resistance.  
PDmax = ( TJmax - TA ) / RθJA (2.1)  
The term junction refers to the point of thermal reference of the semiconductor. Equation 2.1 can  
also be applied to the transient-state:  
PDmax (t) = [ TJmax - TA] / RθJA(t) (2.2)  
Rev B, August 1998  
1

与AN-1026相关器件

型号 品牌 获取价格 描述 数据表
AN-1027 CYMBET

获取价格

Ultra Low Power Microcontroller Backup Using the EnerChip
AN-1028 FAIRCHILD

获取价格

Maximum Power Enhancement Techniques for SOT-223 Power MOSFETs
AN-1029 FAIRCHILD

获取价格

Maximum Power Enhancement Techniques for SO-8 Power MOSFETs
AN103 ETC

获取价格

The FET Constant-Current Source/Limiter
AN-1030 CYMBET

获取价格

EVAL-08 Frequently Asked Questions & Troubleshooting
AN-1032 FAIRCHILD

获取价格

Performance Restrictions Associated with 3.5 Watts SO-8 Power MOSFETs
AN10327 NXP

获取价格

TDA856x and TDA8571J power amplifiers
AN1034 INTERSIL

获取价格

Analog Switch and Multiplexer Applications
AN-1036 CYMBET

获取价格

Using the EnerChip CC in Energy Harvesting Designs
AN10365 NXP

获取价格

Surface mount reflow soldering