Agilent AMMC-5618
6 - 20 GHz Amplifier
Data Sheet
Chip Size:
920 x 920 µm (36.2 x 36.2 mils)
100 ± 10µm (4 ± 0.4 mils)
Chip Size Tolerance:± 10µm (± 0.4 mils)
Chip Thickness:
Pad Dimensions: 80 x 80 µm (3.1 x 3.1 mils or larger)
Description
Agilent’s AMMC-5618 6−20 GHz
MMIC is an efficient two-stage
amplifier designed to be used as
a cascadable intermediate gain
block for EW applications. In
communication systems, it can
be used as a LO buffer, or as a
transmit driver amplifier. It is
fabricated using a PHEMT
Features
Applications
• Frequency Range: 6 − 20 GHz
• High Gain: 14.5 dB Typical
• Output Power: 19.5 dBm Typical
• Driver/Buffer in microwave
communication systems
• Cascadable gain stage for EW
systems
• Input and Output Return Loss: < -12
dB
• Phased array radar and transmit
amplifiers
• Flat Gain Response: ± 0.3 dB Typical
integrated circuit structure that
provides exceptional efficiency
and flat gain performance.
During typical operation with a
single 5-V supply, each gain
stage is biased for Class-A
operation for optimal power
output with minimal distortion.
The RF input and output have
matching circuitry for use in
50-Ω environments. The
backside of the chip is both RF
and DC ground. This helps
simplify the assembly process
and reduces assembly related
performance variations and
costs. The MMIC is a cost
• Single Supply Bias: 5 V @ 107 mA
[1]
AMMC-5618 Absolute Maximum Ratings
Symbol
Parameters/Conditions
Drain Supply Voltage
Optional Gate Voltage
Optional Gate Voltage
Drain Supply Current
Drain Supply Current
RF Input Power
Units
V
Min.
Max.
7
V
V
V
,V
D1 D2
V
-5
-5
+1
G1
G2
V
+1
I
I
mA
mA
dBm
°C
70
D1
D2
84
P
20
in
T
Channel Temp.
+150
ch
T
Operating Backside Temp.
Storage Temp.
°C
-55
-65
b
T
°C
+165
+300
stg
effective alternative to hybrid
(discrete FET) amplifiers that
require complex tuning and
assembly processes.
T
Maximum Assembly Temp. (60 sec max) °C
max
Note:
1. Operation in excess of any one of these conditions may result in permanent damage to this device.
Note: These devices are ESD sensitive. The following precautions are strongly recommended:
Ensure that an ESD approved carrier is used when dice are transported from one destination to another.
Personal grounding is to be worn at all times when handling these devices.