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AMMC-5618-W50 PDF预览

AMMC-5618-W50

更新时间: 2024-01-25 07:05:50
品牌 Logo 应用领域
安捷伦 - AGILENT 射频和微波射频放大器微波放大器
页数 文件大小 规格书
8页 140K
描述
6 - 20 GHz Amplifier

AMMC-5618-W50 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:DIE OR CHIPReach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.33.00.01
风险等级:5.23其他特性:HIGH RELIABILITY
特性阻抗:50 Ω构造:COMPONENT
增益:12.5 dB最大输入功率 (CW):20 dBm
功能数量:1最大工作频率:20000 MHz
最小工作频率:6000 MHz封装等效代码:DIE OR CHIP
电源:5 V射频/微波设备类型:WIDE BAND LOW POWER
子类别:RF/Microwave Amplifiers最大压摆率:140 mA

AMMC-5618-W50 数据手册

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Agilent AMMC-5618  
6 - 20 GHz Amplifier  
Data Sheet  
Chip Size:  
920 x 920 µm (36.2 x 36.2 mils)  
100 ± 10µm (4 ± 0.4 mils)  
Chip Size Tolerance:± 10µm (± 0.4 mils)  
Chip Thickness:  
Pad Dimensions: 80 x 80 µm (3.1 x 3.1 mils or larger)  
Description  
Agilent’s AMMC-5618 620 GHz  
MMIC is an efficient two-stage  
amplifier designed to be used as  
a cascadable intermediate gain  
block for EW applications. In  
communication systems, it can  
be used as a LO buffer, or as a  
transmit driver amplifier. It is  
fabricated using a PHEMT  
Features  
Applications  
Frequency Range: 6 20 GHz  
• High Gain: 14.5 dB Typical  
• Output Power: 19.5 dBm Typical  
• Driver/Buffer in microwave  
communication systems  
• Cascadable gain stage for EW  
systems  
• Input and Output Return Loss: < -12  
dB  
• Phased array radar and transmit  
amplifiers  
Flat Gain Response: ± 0.3 dB Typical  
integrated circuit structure that  
provides exceptional efficiency  
and flat gain performance.  
During typical operation with a  
single 5-V supply, each gain  
stage is biased for Class-A  
operation for optimal power  
output with minimal distortion.  
The RF input and output have  
matching circuitry for use in  
50-environments. The  
backside of the chip is both RF  
and DC ground. This helps  
simplify the assembly process  
and reduces assembly related  
performance variations and  
costs. The MMIC is a cost  
• Single Supply Bias: 5 V @ 107 mA  
[1]  
AMMC-5618 Absolute Maximum Ratings  
Symbol  
Parameters/Conditions  
Drain Supply Voltage  
Optional Gate Voltage  
Optional Gate Voltage  
Drain Supply Current  
Drain Supply Current  
RF Input Power  
Units  
V
Min.  
Max.  
7
V
V
V
,V  
D1 D2  
V
-5  
-5  
+1  
G1  
G2  
V
+1  
I
I
mA  
mA  
dBm  
°C  
70  
D1  
D2  
84  
P
20  
in  
T
Channel Temp.  
+150  
ch  
T
Operating Backside Temp.  
Storage Temp.  
°C  
-55  
-65  
b
T
°C  
+165  
+300  
stg  
effective alternative to hybrid  
(discrete FET) amplifiers that  
require complex tuning and  
assembly processes.  
T
Maximum Assembly Temp. (60 sec max) °C  
max  
Note:  
1. Operation in excess of any one of these conditions may result in permanent damage to this device.  
Note: These devices are ESD sensitive. The following precautions are strongly recommended:  
Ensure that an ESD approved carrier is used when dice are transported from one destination to another.  
Personal grounding is to be worn at all times when handling these devices.  

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