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AMIS-720341 PDF预览

AMIS-720341

更新时间: 2024-11-30 03:18:43
品牌 Logo 应用领域
AMI 传感器图像传感器
页数 文件大小 规格书
16页 1243K
描述
Contact Image Sensor

AMIS-720341 数据手册

 浏览型号AMIS-720341的Datasheet PDF文件第2页浏览型号AMIS-720341的Datasheet PDF文件第3页浏览型号AMIS-720341的Datasheet PDF文件第4页浏览型号AMIS-720341的Datasheet PDF文件第5页浏览型号AMIS-720341的Datasheet PDF文件第6页浏览型号AMIS-720341的Datasheet PDF文件第7页 
AMIS-720341-A: Contact Image Sensor  
Data Sheet  
1.0 Description  
AMI Semiconductor’s AMIS-720341-A (PI3041A) contact image sensor (CIS) chip is a 300 dots per inch (dpi) resolution, linear array  
image sensor chip. The sensor chip is processed using a CMOS image sensing technology and it belongs to the Image Sensor Product  
Line (ISPL) group within AMIS. Designed for cascading multiple chips in a series, the image sensor chips use a chip-on-board process.  
They are bonded end-to-end on a printed circuit board (PCB). This bonding process allows the CIS module manufacturers to produce  
variable CIS module lengths in increments of the chip array lengths. Hence, the modules are easily applied in a large number of  
document scanners found in today’s facsimile market. Some examples of these large document scanners are those that produce wide  
format maps and architectural drawings, down to the narrow width scanners, such as those found in check readers, lotto tickets,  
entrance gates tickets, etc. This is not to exclude office automation equipment, which requires an even more variety in scanning widths,  
as well as those with special mechanically configurations.  
Figure 1 is a block diagram of the imaging sensor chip. Each sensor chip consists of 96 detector elements, their associated  
multiplexing switches, buffers, and a chip selector. The detector's element-to-element spacing is approximately 83.3µm. The size of  
each chip without scribe lines is 8080µm by 380µm. Each sensor chip has seven bonding pads. The pad symbols and functions are  
described in Table 1.  
8080 mm  
Row of 96 Sensors  
and Video Signal  
Multiplexers  
380 mm  
Readout Shift Register  
Chip  
Select  
Buffer  
SP  
Buffer  
Buffer  
CP VDD DGND  
IOUT  
AGND EOS  
Figure 1: AMIS-720341-A Block Diagram  
Table 1: Pad Symbols and Functions  
Symbol  
Function  
SP  
CP  
Start pulse: input clock to start the line scan  
Clock pulse: input clock to clock of the shift register  
Positive supply: +5V supply connected to substrate  
Digital ground: connection topside common  
Signal current output: output for video signal current  
Analog ground: connection topside common  
VDD  
DGND  
IOUT  
AGND  
EOS  
End-of-scan pulse: output from the shift register at end-of-scan  
AMI Semiconductor – May 06, M-20570-001  
1
www.amis.com  
 
 

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