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AMIS-720233-B PDF预览

AMIS-720233-B

更新时间: 2024-11-30 03:18:43
品牌 Logo 应用领域
AMI 传感器换能器图像传感器
页数 文件大小 规格书
12页 516K
描述
Contact Image Sensor

AMIS-720233-B 技术参数

生命周期:TransferredReach Compliance Code:unknown
风险等级:5.76Is Samacsys:N
Base Number Matches:1

AMIS-720233-B 数据手册

 浏览型号AMIS-720233-B的Datasheet PDF文件第2页浏览型号AMIS-720233-B的Datasheet PDF文件第3页浏览型号AMIS-720233-B的Datasheet PDF文件第4页浏览型号AMIS-720233-B的Datasheet PDF文件第5页浏览型号AMIS-720233-B的Datasheet PDF文件第6页浏览型号AMIS-720233-B的Datasheet PDF文件第7页 
AMIS-720233-B: Contact Image Sensor  
Data Sheet  
1.0 General Description  
The AMIS-720233-B (PI3033B) contact image sensor (CIS) chip is a 200 dot per inch (dpi) resolution, linear array image sensor chip.  
The sensor chip is processed with AMI Semiconductor’s proprietary CMOS image sensing technology. Designed for cascading multiple  
chips in a series, the image sensor chips, using chip-on-board process, are bonded end-to-end on a printed circuit board (PCB) in  
varying sensing array lengths. This CIS chip offers image reading widths to suit document scanners found in facsimile, scanner, check  
reader and office automation equipment.  
Figure 1 is a block diagram of the imaging sensor chip. Each sensor chip consists of 64 detector elements, their associated multiplexing  
switches, buffers and a chip selector. The detector's element-to-element spacing is approximately 125um. The size of each chip without  
scribe lines is 7950um by 500um. Each sensor chip has eight bonding pads. Only seven are used to make the CIS modules. The pad  
symbols and functions are described in Table 1.  
7950  
m
Row of 64 Sensors  
and Video Signal  
Multiplexers  
500  
m
Readout Shift Register  
Chip  
Select  
Buffer  
SP  
Buffer  
Buffer  
CP VDD DGND  
IOUT  
RSTLEV  
AGND EOS  
Figure 1: AMIS-720233-B Block Diagram  
Table 1: Pad Symbols and Functions  
Symbol  
Function  
SP  
CP  
VDD  
DGND  
RSTLEV  
IOUT  
AGND  
EOS  
Start pulse: input to start the line scan  
Clock pulse: input to clock the shift register  
Positive supply: +5V supply connected to substrate  
Digital ground: connection topside common  
A bias pad: not used, left floating  
Signal current output: output for video signal current  
Analog ground: connection topside common  
End-of-scan pulse: output from the shift register at end-of-scan  
AMI Semiconductor –May 06, M-20567-001  
1
www.amis.com  
 
 

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