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AMIS-710600-A8 PDF预览

AMIS-710600-A8

更新时间: 2024-11-30 03:18:43
品牌 Logo 应用领域
AMI 传感器换能器图像传感器
页数 文件大小 规格书
7页 291K
描述
600dpi CIS Module

AMIS-710600-A8 技术参数

生命周期:TransferredReach Compliance Code:unknown
风险等级:5.76Base Number Matches:1

AMIS-710600-A8 数据手册

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AMIS-710600-A8: 600dpi CIS Module  
Data Sheet  
1.0 General Description  
The AMIS-710600-A8 (PI600MC-A8) is a contact image sensor (CIS) module. It is a short version within a family of contact image  
sensor modules. It consists of image sensor chips, AMIS-720639 (PI3039), which are also a product of AMIS. This AMIS-720639  
sensor chip is a linear array image sensor chip with a 600 elements per inch resolution. Fabricated with AMI Semiconductor’s  
proprietary CMOS image sensing technology, these sensors are bonded on a printed circuit board (PCB) to produce the AMIS-710600-  
A8 CIS modules. Using the chip-on-board technology, seven sensor chips are bonded to the PCB, forming a linear array module of  
57mm, with a total of 1344 pixel elements. This 57mm active read length lends itself to scanning A8 size documents with 23.62 dots per  
millimeter (dpm) resolution. This short array length module was especially designed for applications in card scanners but it is not limited  
to this specific application. It can be used in various mark readers and other automation equipment requiring narrow scanning modules.  
2.0 Key Features  
Light source, lens and sensor are integrated into a single module  
23.62dpm resolution, 57mm scanning length  
Up to 390µsec/line scanning speed, with 3.5MHz pixel rate  
Wide dynamic range  
Analog output  
Yellow-Green LED light source  
Compact size 12mm x 15mm x 70mm  
Low power  
Light weight  
3.0 Functional Description  
As described in the previous section, the AMIS-710600-A8 imaging array consists of seven image sensors. Each solid-state sensor  
contains an integrated array of photo-detectors with their associated multiplex switches and a digital shift register, to sequentially  
readout each video pixel from its photo-detector. Seven of these integrated array sensors are bonded on the PCB and sequentially  
cascaded to form a CIS line array of 1344 pixel elements. Since each sensor has I/O pads for the shift register start pulse ( SP) and the  
end-of-scan pulse (EOS); each preceding sensor’s EOS in the sequence loads into the following sensor’s SP, providing for a  
continuously scanning array each time the first sensor’s SP in the sequence is loaded. These sequential video pixels from each sensor  
are summed on to a common video line, which terminates into a common buffer amplifier. The output of the amplifier produces the  
output video pixels from the module (see Figure 1).  
The PCB is enclosed in the module housing along with its associated electro-optical components, to form a self-contained imaging  
system. Its array sensors are optically aligned and mounted along with a one-to-one graded indexed micro lens array, which focuses  
the image from the scanned documents onto the sensing plane of its array. Its light source is specially fabricated and aligned with the  
micro lens and its document to form a completely integral CIS imaging system.  
The enclosed module has a cover glass with its surface near or on the focal point for the object being scanned, while it serves to protect  
the imaging sensors, the micro lens assembly and the LED light source from contaminants in the environment, such as dust. The I/O to  
the module is a 10-pin connector located on one end of the module. Figure 2 shows a cross section of the AMIS-710600-A8.  
AMI Semiconductor – July. 06, M-20597-001  
1
www.amis.com  
 

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