AMIS-710600-A8: 600dpi CIS Module
Data Sheet
1.0 General Description
The AMIS-710600-A8 (PI600MC-A8) is a contact image sensor (CIS) module. It is a short version within a family of contact image
sensor modules. It consists of image sensor chips, AMIS-720639 (PI3039), which are also a product of AMIS. This AMIS-720639
sensor chip is a linear array image sensor chip with a 600 elements per inch resolution. Fabricated with AMI Semiconductor’s
proprietary CMOS image sensing technology, these sensors are bonded on a printed circuit board (PCB) to produce the AMIS-710600-
A8 CIS modules. Using the chip-on-board technology, seven sensor chips are bonded to the PCB, forming a linear array module of
57mm, with a total of 1344 pixel elements. This 57mm active read length lends itself to scanning A8 size documents with 23.62 dots per
millimeter (dpm) resolution. This short array length module was especially designed for applications in card scanners but it is not limited
to this specific application. It can be used in various mark readers and other automation equipment requiring narrow scanning modules.
2.0 Key Features
• Light source, lens and sensor are integrated into a single module
• 23.62dpm resolution, 57mm scanning length
• Up to 390µsec/line scanning speed, with 3.5MHz pixel rate
• Wide dynamic range
• Analog output
• Yellow-Green LED light source
• Compact size ≅ 12mm x 15mm x 70mm
• Low power
• Light weight
3.0 Functional Description
As described in the previous section, the AMIS-710600-A8 imaging array consists of seven image sensors. Each solid-state sensor
contains an integrated array of photo-detectors with their associated multiplex switches and a digital shift register, to sequentially
readout each video pixel from its photo-detector. Seven of these integrated array sensors are bonded on the PCB and sequentially
cascaded to form a CIS line array of 1344 pixel elements. Since each sensor has I/O pads for the shift register start pulse ( SP) and the
end-of-scan pulse (EOS); each preceding sensor’s EOS in the sequence loads into the following sensor’s SP, providing for a
continuously scanning array each time the first sensor’s SP in the sequence is loaded. These sequential video pixels from each sensor
are summed on to a common video line, which terminates into a common buffer amplifier. The output of the amplifier produces the
output video pixels from the module (see Figure 1).
The PCB is enclosed in the module housing along with its associated electro-optical components, to form a self-contained imaging
system. Its array sensors are optically aligned and mounted along with a one-to-one graded indexed micro lens array, which focuses
the image from the scanned documents onto the sensing plane of its array. Its light source is specially fabricated and aligned with the
micro lens and its document to form a completely integral CIS imaging system.
The enclosed module has a cover glass with its surface near or on the focal point for the object being scanned, while it serves to protect
the imaging sensors, the micro lens assembly and the LED light source from contaminants in the environment, such as dust. The I/O to
the module is a 10-pin connector located on one end of the module. Figure 2 shows a cross section of the AMIS-710600-A8.
AMI Semiconductor – July. 06, M-20597-001
1
www.amis.com
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