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AMCC924NE PDF预览

AMCC924NE

更新时间: 2024-11-18 07:16:51
品牌 Logo 应用领域
ANALOGPOWER /
页数 文件大小 规格书
3页 93K
描述
Dual N-Channel Logical Level MOSFET

AMCC924NE 数据手册

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Analog Power  
AMCC924NE  
Dual N-Channel Logical Level MOSFET  
These miniature surface mount MOSFETs utilize a  
high cell density trench process to provide low  
rDS(on) and to ensure minimal power loss and heat  
dissipation. Typical applications are DC-DC  
converters and power management in portable and  
battery-powered products such as computers,  
printers, PCMCIA cards, cellular and cordless  
telephones.  
PRODUCT SUMMARY  
VDS (V)  
rDS(on) (OHM)  
ID (A)  
9.2  
8.5  
D
0.012 @ VGS = 4.5 V  
20  
0.014 @ VGS = 2.5V  
DFN 3x3  
D
Top View  
G
G
2
1
Low rDS(on) provides higher efficiency and  
extends battery life  
S1  
G1  
S2  
G2  
1
2
3
4
8
7
6
5
D
D
D
D
S1 S2  
N-Channel N-Channel  
Low thermal impedance copper leadframe  
DFN 3x3 saves board space  
MOSFET MOSFET  
Fast switching speed  
High performance trench technology  
ESD Protected  
2000V  
ABSOLUTE MAXIMUM RATINGS (TA = 25 oC UNLESS OTHERWISE NOTED)  
Parameter Symbol Maximum Units  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
VGS  
20  
8
V
TA=25oC  
TA=70oC  
9.2  
7.5  
40  
Continuous Drain Currenta  
ID  
A
Pulsed Drain Currentb  
IDM  
IS  
Continuous Source Current (Diode Conduction)a  
Power Dissipationa  
1.5  
1.5  
1.0  
A
TA=25oC  
TA=70oC  
PD  
W
oC  
Operating Junction and Storage Temperature Range  
TJ, Tstg -55 to 150  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
RthJA  
Typ  
Max  
83  
t <= 10 sec  
Maximum Junction-to-Ambienta  
Steady State  
72  
oC/W  
100  
120  
Notes  
a.  
b.  
Surface Mounted on 1” x 1” FR4 Board.  
Pulse width limited by maximum junction temperature  
1
Publication Order Number:  
DS-AMCC924NE_B  
PRELIMINARY  

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