AMBQ40T120RFRTH
FieldStop Trench IGBT
Features
General Description
High Speed Switching & Low Power Loss
VCE(sat) = 1.75V @ IC = 40A
High Input Impedance
This IGBT is produced using advanced Magnachip’s Field
Stop Trench IGBT Technology, which provides low VCE(sat)
,
high speed switching and high ruggedness performance and
excellent quality.
trr = 285ns (typ.)
Ultra-Soft, fast recovery anti-parallel diode
Ultra-narrowed VF distribution control
Positive Temperature coefficient for easy paralleling
AEC-Q101 qualified
Applications
E-compressor
PTC Heater
TO-247
G : Gate
C : Collector
E : Emitter
G
C
Package outline and symbol
E
Absolute Maximum Ratings
Characteristics
Symbol
Rating
Unit
Collector-emitter voltage
Gate-emitter voltage
VCES
1200
V
VGE
±25
80
V
A
TC=25°C
DC collector current, limited by Tvjmax
Pulsed collector current, tp limited by Tvjmax
Diode forward current, limited by Tvjmax
Diode pulsed current, Pulse time limited by Tvjmax
Power dissipation
IC
ICpuls
IF
TC=100°C
40
A
160
80
A
TC=25°C
A
TC=100°C
40
A
IFpuls
PD
160
482
242
A
TC=25°C
W
W
TC=100°C
Short circuit withstand time
VCE = 600V, VGE = 15V, TC = 150°C
tSC
10
μs
Operating Junction temperature range
Storage temperature range
Tvj
-40~175
-55~150
°C
°C
Tstg
Thermal Characteristics
Characteristics
Thermal resistance junction-to-ambient
Symbol
Rth(j-a)
Rating
40
Unit
Thermal resistance junction-to-case for IGBT
Thermal resistance junction-to-case for Diode
Rth(j-c)
0.31
0.8
°C/W
Rth(j-c)
Jul, 2023. Revision 1.1
Magnachip semiconductor Ltd.
1