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AM70PDL129CDH66IS PDF预览

AM70PDL129CDH66IS

更新时间: 2024-11-28 06:37:03
品牌 Logo 应用领域
飞索 - SPANSION 闪存存储内存集成电路静态存储器
页数 文件大小 规格书
127页 1923K
描述
Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP)

AM70PDL129CDH66IS 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:LFBGA,
针数:93Reach Compliance Code:compliant
HTS代码:8542.32.00.71风险等级:5.92
Is Samacsys:N其他特性:FLASH IS ORGANIZED AS 8M X 16; PSEUDO SRAM IS ORGANIZED AS 4M X 16
JESD-30 代码:R-PBGA-B93JESD-609代码:e0
长度:13 mm内存密度:134217728 bit
内存集成电路类型:MEMORY CIRCUIT内存宽度:16
功能数量:1端子数量:93
字数:8388608 words字数代码:8000000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:8MX16
封装主体材料:PLASTIC/EPOXY封装代码:LFBGA
封装形状:RECTANGULAR封装形式:GRID ARRAY, LOW PROFILE, FINE PITCH
峰值回流温度(摄氏度):240认证状态:Not Qualified
座面最大高度:1.4 mm最大供电电压 (Vsup):3.1 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:TIN LEAD
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:30
宽度:9 mmBase Number Matches:1

AM70PDL129CDH66IS 数据手册

 浏览型号AM70PDL129CDH66IS的Datasheet PDF文件第2页浏览型号AM70PDL129CDH66IS的Datasheet PDF文件第3页浏览型号AM70PDL129CDH66IS的Datasheet PDF文件第4页浏览型号AM70PDL129CDH66IS的Datasheet PDF文件第5页浏览型号AM70PDL129CDH66IS的Datasheet PDF文件第6页浏览型号AM70PDL129CDH66IS的Datasheet PDF文件第7页 
Am70PDL127CDH/  
Am70PDL129CDH  
Data Sheet  
July 2003  
The following document specifies Spansion memory products that are now offered by both Advanced  
Micro Devices and Fujitsu. Although the document is marked with the name of the company that orig-  
inally developed the specification, these products will be offered to customers of both AMD and  
Fujitsu.  
Continuity of Specifications  
There is no change to this datasheet as a result of offering the device as a Spansion product. Any  
changes that have been made are the result of normal datasheet improvement and are noted in the  
document revision summary, where supported. Future routine revisions will occur when appropriate,  
and changes will be noted in a revision summary.  
Continuity of Ordering Part Numbers  
AMD and Fujitsu continue to support existing part numbers beginning with “Am” and “MBM. To order  
these products, please use only the Ordering Part Numbers listed in this document.  
For More Information  
Please contact your local AMD or Fujitsu sales office for additional information about Spansion  
memory solutions.  
Publication Number 30651 Revision A Amendment +2 Issue Date November 24, 2003  

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