Datasheet > AM70PDL127CDH66IT

AM70PDL127CDH66IT

更新时间： 2024-11-25 03:18:39

品牌	Logo	应用领域
超微 - AMD		闪存存储内存集成电路静态存储器
页数	文件大小	规格书
127页	1923K
描述
2 x 64 Megabit (8 M x 16-Bit) CMOS 3.0 Volt-Only Page Mode Flash Memory Data Storage 128 Megabit (8 M x 16-Bit) CMOS

阅读下载

中文翻译

获取价格

技术参数
数据手册

如果您发现信息不准确，欢迎纠错

AM70PDL127CDH66IT 技术参数

生命周期：	Active	包装说明：	FBGA, BGA93,10X12,32
Reach Compliance Code：	compliant	风险等级：	5.69
Is Samacsys：	N	最长访问时间：	110 ns
JESD-30 代码：	R-PBGA-B93	内存集成电路类型：	MEMORY CIRCUIT
混合内存类型：	FLASH+PSRAM	端子数量：	93
最高工作温度：	85 °C	最低工作温度：	-40 °C
封装主体材料：	PLASTIC/EPOXY	封装代码：	FBGA
封装等效代码：	BGA93,10X12,32	封装形状：	RECTANGULAR
封装形式：	GRID ARRAY, FINE PITCH	电源：	2.9 V
认证状态：	Not Qualified	最大待机电流：	0.000005 A
子类别：	Other Memory ICs	最大压摆率：	0.045 mA
标称供电电压 (Vsup)：	2.9 V	表面贴装：	YES
技术：	CMOS	温度等级：	INDUSTRIAL
端子形式：	BALL	端子节距：	0.8 mm
端子位置：	BOTTOM	Base Number Matches：	1

AM70PDL127CDH66IT 数据手册

浏览型号AM70PDL127CDH66IT的Datasheet PDF文件第2页

浏览型号AM70PDL127CDH66IT的Datasheet PDF文件第3页

浏览型号AM70PDL127CDH66IT的Datasheet PDF文件第4页

浏览型号AM70PDL127CDH66IT的Datasheet PDF文件第5页

浏览型号AM70PDL127CDH66IT的Datasheet PDF文件第6页

Am70PDL127CDH/

Am70PDL129CDH

Data Sheet

July 2003

The following document specifies Spansion memory products that are now offered by both Advanced

Micro Devices and Fujitsu. Although the document is marked with the name of the company that orig-

inally developed the specification, these products will be offered to customers of both AMD and

Fujitsu.

Continuity of Specifications

There is no change to this datasheet as a result of offering the device as a Spansion product. Any

changes that have been made are the result of normal datasheet improvement and are noted in the

document revision summary, where supported. Future routine revisions will occur when appropriate,

and changes will be noted in a revision summary.

Continuity of Ordering Part Numbers

AMD and Fujitsu continue to support existing part numbers beginning with “Am” and “MBM”. To order

these products, please use only the Ordering Part Numbers listed in this document.

For More Information

Please contact your local AMD or Fujitsu sales office for additional information about Spansion

memory solutions.

Publication Number 30651 Revision A Amendment +2 Issue Date November 24, 2003

12 3 4 5 6 7...127

中文翻译

下载PDF

与AM70PDL127CDH66IT相关器件

型号	品牌	获取价格	描述	数据表
AM70PDL127CDH85FS	SPANSION	获取价格	Memory Circuit, 8MX16, CMOS, PBGA93, 13 X 9 MM, FBGA-93
AM70PDL127CDH85FT	SPANSION	获取价格	Memory Circuit, 8MX16, CMOS, PBGA93, 13 X 9 MM, FBGA-93
AM70PDL127CDH85I	SPANSION	获取价格	Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM
AM70PDL127CDH85IS	AMD	获取价格	2 x 64 Megabit (8 M x 16-Bit) CMOS 3.0 Volt-Only Page Mode Flash Memory Data Storage 128 M
AM70PDL127CDH85IS	SPANSION	获取价格	Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM
AM70PDL127CDH85IT	SPANSION	获取价格	Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM
AM70PDL127CDH85IT	AMD	获取价格	2 x 64 Megabit (8 M x 16-Bit) CMOS 3.0 Volt-Only Page Mode Flash Memory Data Storage 128 M
AM70PDL129BDH	SPANSION	获取价格	2 x 64 Megabit (8 M x 16-Bit) CMOS 3.0 Volt-Only Page Mode Flash Memory Data Storage 128 M
AM70PDL129BDH66FS	SPANSION	获取价格	Memory Circuit, 8MX16, CMOS, PBGA93, 13 X 9 MM, FBGA-93
AM70PDL129BDH66FT	SPANSION	获取价格	Memory Circuit, 8MX16, CMOS, PBGA93, 13 X 9 MM, FBGA-93

与AM70PDL127CDH66IT相关文章

解析光耦仿真器：升级光耦合器技术的必要性
2024-11-18

42
英伟达新一代Blackwell GPU过热问题致交付延迟
2024-11-18

33
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
2024-11-14

61
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
2024-11-14

57

产品中心

服务支持

精选活动

关于我们

帮助中心

AM70PDL127CDH66IT

AM70PDL127CDH66IT 技术参数

AM70PDL127CDH66IT 数据手册

与AM70PDL127CDH66IT相关器件

与AM70PDL127CDH66IT相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

AM70PDL127CDH66IT

AM70PDL127CDH66IT 技术参数

AM70PDL127CDH66IT 数据手册

与AM70PDL127CDH66IT相关器件

与AM70PDL127CDH66IT相关文章

您还可以找

您在本页遇到什么问题？