PRELIMINARY
Am42BDS640AG
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
Am29BDS640G 64 Megabit (4 M x 16-Bit) CMOS 1.8 Volt-only, Simultaneous Operation,
Burst Mode Flash Memory and 16 Mbit (1 M x 16-Bit) Static RAM
DISTINCTIVE CHARACTERISTICS
■ Power dissipation (typical values, CL = 30 pF)
MCP Features
■ Power supply voltage of 1.65 to 1.95 volt
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Burst Mode Read: 10 mA
Simultaneous Operation: 25 mA
Program/Erase: 15 mA
■ High performance
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Access time as fast as 70 ns
Standby mode: 0.2 µA
■ Package
HARDWARE FEATURES
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93-Ball FBGA
■ Software command sector locking
■ Handshaking: host monitors operations via RDY output
■ Hardware reset input (RESET#)
■ WP# input
■ Operating Temperature
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–40°C to +85°C
Flash Memory Features
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Write protect (WP#) function protects sectors 0, 1 (bottom
boot) or sectors 132 and 133 (top boot), regardless of sector
protect status
ARCHITECTURAL ADVANTAGES
■ Single 1.8 volt read, program and erase (1.65 to 1.95 volt)
■ Manufactured on 0.17 µm process technology
■ Simultaneous Read/Write operation
■ ACC input: Acceleration function reduces programming
time; all sectors locked when ACC = VIL
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Data can be continuously read from one bank while
executing erase/program functions in other bank
■ CMOS compatible inputs, CMOS compatible outputs
■ Low VCC write inhibit
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Zero latency between read and write operations
Four bank architecture: 16Mb/16Mb/16Mb/16Mb
SOFTWARE FEATURES
■ Programmable Burst Interface
■ Supports Common Flash Memory Interface (CFI)
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2 Modes of Burst Read Operation
■ Software command set compatible with JEDEC 42.4
Linear Burst: 8, 16, and 32 words with wrap-around
Continuous Sequential Burst
standards
■ Data# Polling and toggle bits
■ Erase Suspend/Resume
■ Sector Architecture
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Eight 8 Kword sectors and one hundred twenty-six 32
Kword sectors
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Suspends or resumes an erase operation in one sector to
read data from, or program data to, other sectors
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Banks A and D each contain four 8 Kword sectors and
thirty-one 32 Kword sectors; Banks B and C each contain
thirty-two 32 Kword sectors
■ Unlock Bypass Program command
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Reduces overall programming time when issuing multiple
program command sequences
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Eight 8 Kword boot sectors, four at the top of the address
range, and four at the bottom of the address range
■ Minimum 1 million erase cycle guarantee per sector
■ 20-year data retention at 125°C
SRAM Features
■ Power dissipation
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Operating: 3 mA maximum
Standby: 15 µA maximum
PERFORMANCE CHARCTERISTICS
■ Read access times at 54/40 MHz
■ CE1s# and CE2s Chip Select
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Burst access times of 13.5/20 ns @ 30 pF at industrial
temperature range
■ Power down features using CE1s# and CE2s
■ Data retention supply voltage: 1.0 to 2.2 volt
■ Byte data control: LB#s (DQ7–DQ0), UB#s (DQ15–DQ8)
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Asynchronous random access times of 70 ns (at 30 pF)
Synchronous latency of 87.5/95 ns
Publication# 26445 Rev: A Amendment/0
Issue Date: May 20, 2002
This document contains information on a product under development at Advanced Micro Devices. The information
is intended to help you evaluate this product. AMD reserves the right to change or discontinue work on this proposed
product without notice.
Refer to AMD’s Website (www.amd.com) for the latest information.