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AM3872BCYEA80 PDF预览

AM3872BCYEA80

更新时间： 2024-01-20 15:37:46
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德州仪器 - TI 微控制器和处理器外围集成电路微处理器时钟
页数 文件大小 规格书
345页 2227K
描述
AM387x Sitara ARM Microprocessors (MPUs)

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AM3872BCYEA80 技术参数

是否Rohs认证： 符合生命周期：Obsolete
零件包装代码：BGA包装说明：23 X 23 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, FCBGA-684
针数：684Reach Compliance Code：compliant
ECCN代码：3A991.A.2HTS代码：8542.31.00.01
风险等级：5.84Is Samacsys：N
地址总线宽度：16位大小：32
边界扫描：YES最大时钟频率：30 MHz
外部数据总线宽度：16格式：FLOATING POINT
集成缓存：YESJESD-30 代码：S-PBGA-B684
长度：23 mm低功率模式：YES
端子数量：684封装主体材料：PLASTIC/EPOXY
封装代码：FBGA封装等效代码：BGA684,28X28,32
封装形状：SQUARE封装形式：GRID ARRAY, FINE PITCH
峰值回流温度（摄氏度）：NOT SPECIFIED电源：0.95/1.35 V
认证状态：Not Qualified座面最大高度：3.06 mm
速度：800 MHz子类别：Microprocessors
最大供电电压：1.42 V最小供电电压：1.28 V
标称供电电压：1.35 V表面贴装：YES
技术：CMOS端子形式：BALL
端子节距：0.8 mm端子位置：BOTTOM
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：23 mm
uPs/uCs/外围集成电路类型：MICROPROCESSORBase Number Matches：1

AM3872BCYEA80 数据手册

 浏览型号AM3872BCYEA80的Datasheet PDF文件第2页浏览型号AM3872BCYEA80的Datasheet PDF文件第3页浏览型号AM3872BCYEA80的Datasheet PDF文件第4页浏览型号AM3872BCYEA80的Datasheet PDF文件第5页浏览型号AM3872BCYEA80的Datasheet PDF文件第6页浏览型号AM3872BCYEA80的Datasheet PDF文件第7页 
AM3874, AM3872, AM3871  
www.ti.com  
SPRS695–SEPTEMBER 2011  
AM387x Sitara™  
ARM® Microprocessors (MPUs)  
Check for Samples: AM3874, AM3872, AM3871  
1 High-Performance System-on-Chip (SoC)  
1.1 Features  
12  
8-bit SD Capture Ports  
• High-Performance Sitara™ ARM®  
Microprocessors (MPUs)  
– Up to 1-GHz ARM® Cortex™-A8 RISC MPU  
• ARM® Cortex™-A8 Core  
•
•
One 8/16/24-bit Input  
One 8-bit Only Input  
– Two 165 MHz HD Video Display Outputs  
One 16/24/30-bit and one 16/24-bit Output  
– ARMv7 Architecture  
•
•
In-Order, Dual-Issue, Superscalar  
Microprocessor Core  
– Composite or S-Video Analog Output  
– MacroVision® Support Available  
•
•
•
NEON™ Multimedia Architecture  
Supports Integer and Floating Point  
Jazelle® RCT Execution Environment  
– Digital HDMI 1.3 transmitter With Integrated  
PHY  
– Advanced Video Processing Features Such  
as Scan/Format/Rate Conversion  
– Three Graphics Layers and Compositors  
• Dual 32-bit LPDDR/DDR2/DDR3 SDRAM  
• ARM® Cortex™-A8 Memory Architecture  
– 32K-Byte Instruction and Data Caches  
– 512K-Byte L2 Cache  
– 64K-Byte RAM, 48K-Byte Boot ROM  
• 128K-Bytes On-Chip Memory Controller  
(OCMC) RAM  
• Imaging Subsystem (ISS)  
– Camera Sensor Connection  
Interfaces  
– Supports up to LPDDR-400, DDR2-800, and  
DDR3-800  
– Up to Eight x 8 Devices Total 2 GB Total  
Address Space  
– Dynamic Memory Manager (DMM)  
•
Parallel Connection for Raw (up to 16-Bit)  
and BT.656/BT.1120 (8-/16-bit)  
•
Programmable Multi-Zone Memory  
Mapping and Interleaving  
– Image Sensor Interface (ISIF) for Handling  
Image/Video Data From the Camera Sensor  
– Resizer  
•
•
Enables Efficient 2D Block Accesses  
Supports Tiled Objects in 0°, 90°, 180°, or  
270° Orientation and Mirroring  
•
•
Resizing Image/Video From 1/16x to 8x  
Generating Two Different Resizing  
Outputs Concurrently  
•
Optimizes Interlaced Accesses  
• General Purpose Memory Controller (GPMC)  
– 8-/16-bit Multiplexed Address/Data Bus  
• Media Controller  
– 512M-Byte Total Address Space Divided  
– Controls the HDVPSS and ISS  
• SGX530 3D Graphics Engine  
– Delivers up to 18 MPoly/sec  
– Universal Scalable Shader Engine  
Among up to 8 Chip Selects  
– Glueless Interface to NOR Flash, NAND  
Flash (BCH/Hamming Error Code Detection),  
SRAM and Pseudo-SRAM  
– Error Locator Module (ELM) Outside of  
GPMC to Provide Upto 16-Bit/512-Bytes  
Hardware ECC for NAND  
– Direct3D Mobile, OpenGLES 1.1 and 2.0,  
OpenVG 1.0, OpenMax API Support  
– Advanced Geometry DMA Driven Operation  
– Programmable HQ Image Anti-Aliasing  
• Endianness  
– Flexible Asynchronous Protocol Control for  
Interface to FPGA, CPLD, ASICs, etc.  
– ARM Instructions/Data – Little Endian  
• HD Video Processing Subsystem (HDVPSS)  
– Two 165 MHz HD Video Capture Inputs  
• Enhanced Direct-Memory-Access (EDMA)  
Controller  
– Four Transfer Controllers  
– 64/8 Independent DMA/QDMA Channels  
•
One 16/24-bit Input, Splittable into Dual  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
All trademarks are the property of their respective owners.  
PRODUCT PREVIEW information concerns products in the formative  
or design phase of development. Characteristic data and other  
specifications are design goals. Texas Instruments reserves the right  
to change or discontinue these products without notice.  
Copyright © 2011, Texas Instruments Incorporated  
 
 
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