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AM3872BCYEA100 PDF预览

AM3872BCYEA100

更新时间： 2024-02-26 11:33:15
品牌 Logo 应用领域
德州仪器 - TI 时钟外围集成电路
页数 文件大小 规格书
352页 2414K
描述
MICROPROCESSOR, PBGA684, LEAD FREE, PLASTIC, BGA-684

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AM3872BCYEA100 技术参数

生命周期：Obsolete零件包装代码：BGA
包装说明：FBGA,针数：684
Reach Compliance Code：unknown风险等级：5.84
地址总线宽度：15位大小：32
边界扫描：YES最大时钟频率：30 MHz
外部数据总线宽度：32格式：FLOATING POINT
集成缓存：YESJESD-30 代码：S-PBGA-B684
长度：23 mm低功率模式：YES
端子数量：684封装主体材料：PLASTIC/EPOXY
封装代码：FBGA封装形状：SQUARE
封装形式：GRID ARRAY, FINE PITCH认证状态：Not Qualified
座面最大高度：3.06 mm速度：1000 MHz
表面贴装：YES技术：CMOS
端子形式：BALL端子节距：0.8 mm
端子位置：BOTTOM宽度：23 mm
uPs/uCs/外围集成电路类型：MICROPROCESSORBase Number Matches：1

AM3872BCYEA100 数据手册

 浏览型号AM3872BCYEA100的Datasheet PDF文件第2页浏览型号AM3872BCYEA100的Datasheet PDF文件第3页浏览型号AM3872BCYEA100的Datasheet PDF文件第4页浏览型号AM3872BCYEA100的Datasheet PDF文件第5页浏览型号AM3872BCYEA100的Datasheet PDF文件第6页浏览型号AM3872BCYEA100的Datasheet PDF文件第7页 
AM3874, AM3871  
www.ti.com  
SPRS695B –SEPTEMBER 2011–REVISED SEPTEMBER 2012  
AM387x Sitara™  
ARM® Processors  
Check for Samples: AM3874, AM3871  
1 High-Performance System-on-Chip (SoC)  
1.1 Features  
12  
– Two 165 MHz HD Video Display Outputs  
One 16/24/30-bit and one 16/24-bit Output  
• High-Performance Sitara™ ARM® Processors  
• ARM® Cortex™-A8 Core  
•
– Composite or S-Video Analog Output  
– MacroVision® Support Available  
– Digital HDMI 1.3 transmitter With Integrated  
PHY  
– Advanced Video Processing Features Such  
as Scan/Format/Rate Conversion  
– ARMv7 Architecture  
•
In-Order, Dual-Issue, Superscalar  
Processor Core  
•
•
•
NEON™ Multimedia Architecture  
Supports Integer and Floating Point  
Jazelle® RCT Execution Environment  
– Three Graphics Layers and Compositors  
• Dual 32-bit DDR2/DDR3 SDRAM Interfaces  
– Supports up to DDR2-800 and DDR3-800  
• ARM® Cortex™-A8 Memory Architecture  
– 32K-Byte Instruction and Data Caches  
– 512K-Byte L2 Cache  
– 64K-Byte RAM, 48K-Byte Boot ROM  
• 128K-Bytes On-Chip Memory Controller  
(OCMC) RAM  
– Up to Eight x 8 Devices Total 2 GB Total  
Address Space  
– Dynamic Memory Manager (DMM)  
•
Programmable Multi-Zone Memory  
Mapping and Interleaving  
• Imaging Subsystem (ISS)  
– Camera Sensor Connection  
•
•
Enables Efficient 2D Block Accesses  
Supports Tiled Objects in 0°, 90°, 180°, or  
270° Orientation and Mirroring  
•
Parallel Connection for Raw (up to 16-Bit)  
and BT.656/BT.1120 (8-/16-bit)  
– Image Sensor Interface (ISIF) for Handling  
Image/Video Data From the Camera Sensor  
– Resizer  
•
Optimizes Interlaced Accesses  
• General Purpose Memory Controller (GPMC)  
– 8-/16-bit Multiplexed Address/Data Bus  
•
•
Resizing Image/Video From 1/16x to 8x  
Generating Two Different Resizing  
Outputs Concurrently  
– 512M-Byte Total Address Space Divided  
Among up to 8 Chip Selects  
– Glueless Interface to NOR Flash, NAND  
Flash (BCH/Hamming Error Code Detection),  
SRAM and Pseudo-SRAM  
– Error Locator Module (ELM) Outside of  
GPMC to Provide Upto 16-Bit/512-Bytes  
Hardware ECC for NAND  
• Media Controller  
– Controls the HDVPSS and ISS  
• SGX530 3D Graphics Engine  
– Delivers up to 25 MPoly/sec  
– Universal Scalable Shader Engine  
– Direct3D Mobile, OpenGLES 1.1 and 2.0,  
OpenVG 1.0, OpenMax API Support  
– Advanced Geometry DMA Driven Operation  
– Programmable HQ Image Anti-Aliasing  
• Endianness  
– Flexible Asynchronous Protocol Control for  
Interface to FPGA, CPLD, ASICs, and so  
Forth  
• Enhanced Direct-Memory-Access (EDMA)  
Controller  
– Four Transfer Controllers  
– 64/8 Independent DMA/QDMA Channels  
• Dual Port Ethernet (10/100/1000 Mb/s) With  
Optional Switch  
– ARM Instructions/Data – Little Endian  
• HD Video Processing Subsystem (HDVPSS)  
– Two 165 MHz HD Video Capture Inputs  
•
One 16/24-bit Input, Splittable into Dual 8-  
bit SD Capture Ports  
– IEEE 802.3 Compliant (3.3V I/O Only)  
– MII/RMII/GMII/RGMII Media Independent I/Fs  
– Management Data I/O (MDIO) Module  
•
•
One 8/16/24-bit Input  
One 8-bit Only Input  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
All trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date. Products conform to  
specifications per the terms of the Texas Instruments standard warranty. Production  
processing does not necessarily include testing of all parameters.  
Copyright © 2011–2012, Texas Instruments Incorporated  
 
 
 
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