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AM29F800BT-90DPI2 PDF预览

AM29F800BT-90DPI2

更新时间: 2024-11-04 14:47:43
品牌 Logo 应用领域
飞索 - SPANSION 内存集成电路
页数 文件大小 规格书
12页 400K
描述
Flash, 512KX16, 90ns, DIE-44

AM29F800BT-90DPI2 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:DIE包装说明:DIE-44
针数:44Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.32.00.51
风险等级:5.26最长访问时间:90 ns
其他特性:TOP BOOT BLOCK备用内存宽度:8
启动块:TOPJESD-30 代码:R-XUUC-N44
JESD-609代码:e0内存密度:8388608 bit
内存集成电路类型:FLASH内存宽度:16
功能数量:1端子数量:44
字数:524288 words字数代码:512000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:512KX16
封装主体材料:UNSPECIFIED封装代码:DIE
封装形状:RECTANGULAR封装形式:UNCASED CHIP
并行/串行:PARALLEL峰值回流温度(摄氏度):240
编程电压:5 V认证状态:Not Qualified
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:TIN LEAD端子形式:NO LEAD
端子位置:UPPER处于峰值回流温度下的最长时间:30
类型:NOR TYPEBase Number Matches:1

AM29F800BT-90DPI2 数据手册

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Am29F800B Known Good Die  
Data Sheet (Retired Product)  
Am29F800B Known Good Die Cover Sheet  
This product has been retired and is not recommended for designs. Please contact your Spansion representative for  
alternates. Availability of this document is retained for reference and historical purposes only.  
The following document contains information on Spansion memory products.  
Continuity of Specifications  
There is no change to this data sheet as a result of offering the device as a Spansion product. Any changes that have been  
made are the result of normal data sheet improvement and are noted in the document revision summary.  
For More Information  
Please contact your local sales office for additional information about Spansion memory solutions.  
Publication Number 21631  
Revision C  
Amendment 4  
Issue Date March 3, 2009  

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