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AM29F040B-55JDB PDF预览

AM29F040B-55JDB

更新时间: 2024-11-23 13:05:31
品牌 Logo 应用领域
飞索 - SPANSION /
页数 文件大小 规格书
36页 918K
描述
Flash, 512KX8, 55ns, PQCC32, PLASTIC, LCC-32

AM29F040B-55JDB 技术参数

是否Rohs认证:符合生命周期:Obsolete
零件包装代码:QFJ包装说明:QCCJ,
针数:32Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.32.00.51
风险等级:5.2Is Samacsys:N
最长访问时间:55 ns其他特性:1000K PROGRAM/ERASE CYCLES; DATA RETENTION 20 YEARS
数据保留时间-最小值:20JESD-30 代码:R-PQCC-J32
JESD-609代码:e3长度:13.97 mm
内存密度:4194304 bit内存集成电路类型:FLASH
内存宽度:8功能数量:1
端子数量:32字数:524288 words
字数代码:512000工作模式:ASYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:512KX8封装主体材料:PLASTIC/EPOXY
封装代码:QCCJ封装形状:RECTANGULAR
封装形式:CHIP CARRIER并行/串行:PARALLEL
峰值回流温度(摄氏度):260编程电压:5 V
认证状态:Not Qualified座面最大高度:3.55 mm
最大供电电压 (Vsup):5.25 V最小供电电压 (Vsup):4.75 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Matte Tin (Sn)端子形式:J BEND
端子节距:1.27 mm端子位置:QUAD
处于峰值回流温度下的最长时间:40类型:NOR TYPE
宽度:11.43 mmBase Number Matches:1

AM29F040B-55JDB 数据手册

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Am29F040B  
Data Sheet  
Am29F040B Cover Sheet  
The following document contains information on Spansion memory products.  
Continuity of Specifications  
There is no change to this data sheet as a result of offering the device as a Spansion product. Any changes that have been  
made are the result of normal data sheet improvement and are noted in the document revision summary.  
For More Information  
Please contact your local sales office for additional information about Spansion memory solutions.  
Publication Number 21445  
Revision E  
Amendment 8  
Issue Date November 11, 2009  

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