plerowTM ALE2350T2
Internally Matched LNA Module
Features
Description
The plerowTM ALN-series is the compactly designed surface-mount
module for the use of the LNA with or without the following gain blocks in
the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS,
PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communi-
cation terminals, CATV and so on. It has an exceptional performance of
low noise figure, high gain, high OIP3, and low bias current. The stability
factor is always kept more than unity over the application band in order
to ensure its unconditionally stable implementation to the application
system environment. The surface-mount module package including the
completed matching circuit and other components necessary just in case
allows very simple and convenient implementation onto the system
board in mass production level.
· S21 = 24.8 dB@2300 MHz
= 24.2 dB@2400 MHz
· NF of 0.75 dB over Frequency
· Unconditionally Stable
· Single 5V Supply
· High OIP3@Low Current
Specifications (in Production)
Typ.@T = 25°C, Vs = 5 V, Freq. = 2350 MHz, Zo.sys = 50 ohms
2-stage Single Type
Specifications
Typ
Parameter
Unit
Min
2300
23.5
Max
Frequency Range
Gain
MHz
dB
2400
24.5
±0.3
0.75
42
More Information
Gain Flatness
dB
±0.4
Website: www.asb.co.kr
E-mail: sales@asb.co.kr
Noise Figure
Output IP3 (1)
S11/S22 (2)
dB
0.80
dBm
dB
39
23
Tel: (82) 42-528-7223
Fax: (82) 42-528-7222
-18/-15
220
Output P1dB
dBm
msec
mA
V
24
Switching Time (3)
Supply Current
Supply Voltage
Impedance
-
200
5
50
W
Max. RF Input Power
Package Type & Size
Operating temperature is -40°C to +85°C.
dBm
mm
C.W 29~31 (before fail)
Surface Mount Type, 10Wx10Lx3.8H
1) OIP3 is measured with two tones at an output power of 7 dBm/tone separated by 1 MHz.
2) S11/S22 (max) is the worst value within the frequency band.
3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS.
Outline Drawing (Unit: mm)
Pin Number
Function
RF In
2
5
6
plerow
RF Out
Vs
ALE2350T2
ASB Inc.
Others
Ground
(Top View)
(Bottom View)
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
Solder Stencil Area
(Side View)
Ø0.4 plated thru holes to ground plane
(Recommended Footprint)
1/3
www.asb.co.kr
July 2009
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