Datasheet > ALC-318-MGT

ALC-318-MGT

更新时间： 2024-11-29 03:33:03

品牌	Logo	应用领域
申泰 - SAMTEC		/
页数	文件大小	规格书
1页	221K
描述
IC Socket, DIP18, 18 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder,

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

ALC-318-MGT 数据手册

F-210-1 SUPPLEMENT

ALC–314–SGT

ALC–624–NGG

(2,54mm) .100"

ALC SERIES

ALUMINUM DIP SOCKET CARRIER

Mates with:

APA

OTHER

OPTION

PLATING

OPTION

ROW SPACING &

NO. OF CONTACTS

STYLE

OPTION

ALC

Aluminum

Carriers

for Direct

Soldering to

–L

= Locking

Socket

= 30µ" (0,76µm) Gold

Contact 10µ" (0,25µm)

Gold Shell

Specify from chart below

PC Boards

Requires Style

–S, –ZS, or –ZP

and .035" .003"

board hole.

Samtec aluminum

-3XX

carriers are available in

the most popular DIP

lead counts for direct

mounting of lead

sockets to the printed

circuit board.

They are ideal for vapor

phase, infrared and

other high temperature

soldering techniques.

= 30µ" (0,76µm)

Gold Contact,

Tin Shell

=(7,62)

.300

-6XX

(2,54)

.100

=(15,24) .600

TYP

Row

No. of

Contacts

Space

(7,62)

.300

= Tin Contact

and Shell

–314

–316

–318

–320

–324

–624

–628

–632

–640

(3,43)

.135

(Styles –S,–ZS,

–L,–M,–N only)

(7,62)

.300

Requires GT Plating Option

Low insertion force,

six-ﬁnger contacts or

standard insertion force

four-ﬁnger contacts are

available. Shell styles

include ultra-low proﬁle

designs.

Lead DIA Accepted

= 10µ" (0,25µm) Gold

Contact Tin Shell

(Styles –S & –ZS only)

= .015" to .022" (0,38mm to 0,56mm)

Insertion Depth

= .095" to .150" (2.41mm to 3,81mm)

Component Part No. = SC-1L1 or EZ-1L1

(15,24)

.600

Low Insertion Force (LIF) Contacts Available.

SPECIFICATIONS

= Low Proﬁle, Hollow Leg

= Standard Solder Tail

–L

For complete speciﬁcations

see www.samtec.com?ALC

–S

For LIF Specify –ZS

For LIF Specify –ZL

Insulator Material:

None

Carrier Material:

(0,76)

Aluminum

.030

(5,84)

(7,62)

.300

Contact: BeCu

.230

.010

(1,32)

.052

DIA

(1,32)

.052

DIA

Locking lead

(–L) available.

See OPTION.

(2,74)

.108

.010

Shell: Brass

Plating:

Au over 50µ" (1,27µm) Ni

or Sn over 100µ" (2,54µm)

Cu or 50µ" (1,27µm) Ni

Current Rating:

(0,74)

.029

DIA

(0,51)

(3,18)

.125

.020

DIA

1 A

Lead DIA Accepted = .015" to .020" (0,38mm to 0,51mm)

Insertion Depth = .105" to .170" (2,76mm to 4,32mm)

Style L Component Part No. = SC-3P1

Lead DIA Accepted = .015" to .022" (0,38mm to 0,56mm)

Insertion Depth = .095" to .150" (2,41mm to 3,81mm)

Style S Component Part No. = SC-1P1

Contact Resistance:

10 mΩ min

Style ZL Component Part No. = EZ-3P1

Style ZS Component Part No. = EZ-1P1

Insertion Force:

Standard = 9 oz (2,50N)

avg, 16 oz (4,45N) max

Low Insertion Force =

2.5 oz (0,70N) avg, 5.5 oz

(1,53N) max

= Low Proﬁle, Standard Mount

= Low Proﬁle, Micro Socket

–M

–N

For LIF Specify –ZM

For LIF Specify –ZN

Withdrawal Force:

Standard = 2.5 oz (0,70N) avg,

1.5 oz (0,42N) min

Low Insertion Force = 2.0 oz

(0,56N) avg, 0.35 oz (0,10N)

min except Styles ZM & ZN

= 2.0 oz (0,56N) avg, 0.5 oz

(0,14N) min

(0,51)

.020

(1,32)

.052

DIA

(0,76)

.030

(1,32)

.052

DIA

(4,83)

.190

.010

(5,20)

.205

(2,41)

.095

.010

(0,74)

.029

DIA

(0,51)

.020

DIA

(0,89)

.035

Lead DIA Accepted = .016" to .020" (0,41mm to 0,51mm)

Insertion Depth = .080" to .150"

Style N Component Part No. = SC-5P1

Style ZN Component Part No. = EZ-5P1

Note:

Lead DIA Accepted = .016" to .021" (0,41mm to 0,53mm

Insertion Depth = .080" to .115" (2,03mm to 2,92,mm)

Style M Component Part No. = SC-4P1

Some sizes, styles and

options are non-standard,

non-returnable.

Style ZM Component Part No. = EZ-4P1

WWW.SAMTEC.COM

中文翻译

下载PDF

与ALC-318-MGT相关器件

型号	品牌	获取价格	描述	数据表
ALC-318-MGT-L	SAMTEC	获取价格	IC Socket, DIP18, 18 Contact(s),
ALC-318-MTT	SAMTEC	获取价格	IC Socket, DIP18, 18 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder,
ALC-318-MTT-L	SAMTEC	获取价格	IC Socket, DIP18, 18 Contact(s),
ALC-318-NGG	SAMTEC	获取价格	IC Socket, DIP18, 18 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder,
ALC-318-NGG-L	SAMTEC	获取价格	暂无描述
ALC-318-NGT	SAMTEC	获取价格	IC Socket, DIP18, 18 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder,
ALC-318-NGT-L	SAMTEC	获取价格	IC Socket, DIP18, 18 Contact(s),
ALC-318-NTT	SAMTEC	获取价格	IC Socket, DIP18, 18 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder,
ALC-318-NTT-L	SAMTEC	获取价格	IC Socket, DIP18, 18 Contact(s),
ALC-318-PGG	SAMTEC	获取价格	IC Socket, DIP18, 18 Contact(s),

与ALC-318-MGT相关文章

解析光耦仿真器：升级光耦合器技术的必要性
2024-11-18

47
英伟达新一代Blackwell GPU过热问题致交付延迟
2024-11-18

35
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
2024-11-14

65
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
2024-11-14

61

产品中心

服务支持

精选活动

关于我们

帮助中心

ALC-318-MGT

ALC-318-MGT 数据手册

与ALC-318-MGT相关器件

与ALC-318-MGT相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

ALC-318-MGT

ALC-318-MGT 数据手册

与ALC-318-MGT相关器件

与ALC-318-MGT相关文章

您还可以找

您在本页遇到什么问题？