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AK584096BSP-70 PDF预览

AK584096BSP-70

更新时间: 2024-09-17 15:27:47
品牌 Logo 应用领域
ACCUTEK 动态存储器内存集成电路
页数 文件大小 规格书
2页 72K
描述
DRAM Module, 4MX8, 70ns, CMOS, SIMM-30

AK584096BSP-70 技术参数

生命周期:Contact Manufacturer零件包装代码:SIMM
包装说明:SIMM, SIM30针数:30
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.32.00.02风险等级:5.53
访问模式:PAGE最长访问时间:70 ns
其他特性:CAS BEFORE RAS REFRESHI/O 类型:COMMON
JESD-30 代码:R-XSMA-N30内存密度:33554432 bit
内存集成电路类型:DRAM MODULE内存宽度:8
功能数量:1端口数量:1
端子数量:30字数:4194304 words
字数代码:4000000工作模式:ASYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:4MX8输出特性:3-STATE
封装主体材料:UNSPECIFIED封装代码:SIMM
封装等效代码:SIM30封装形状:RECTANGULAR
封装形式:MICROELECTRONIC ASSEMBLY电源:5 V
认证状态:Not Qualified刷新周期:2048
座面最大高度:13.97 mm最大待机电流:0.002 A
子类别:DRAMs标称供电电压 (Vsup):5 V
表面贴装:NO技术:CMOS
温度等级:COMMERCIAL端子形式:NO LEAD
端子节距:2.54 mm端子位置:SINGLE
Base Number Matches:1

AK584096BSP-70 数据手册

 浏览型号AK584096BSP-70的Datasheet PDF文件第2页 
Accutek  
Microcircuit  
Corporation  
AK584096BS / AK584096BG  
4,194,304 Word by 8 Bit CMOS  
Dynamic Random Access Memory  
Front View  
30-Pin SIM  
DESCRIPTION  
The Accutek AK584096 high density memory module is a CMOS  
dynamic RAM organized in 4 Meg x 8 bit words. The assembly con-  
sists of two 4 Meg x 4 DRAMS, mounted on the front side of a printed  
circuit board in 30 pad SIM (leadless) or 30 pin SIP (leaded) configu-  
ration with JEDEC-standard pinouts. Designed especially for  
low-height applications such as VMEbus boards, this low profile  
module is 0.550 inch high.  
+
+
1
30  
30-Pin SIP  
+
1
+
The operation is identical to eight 4 Meg x 1 DRAMs. The data in-  
put/output is brought out separately for each bit, with common RAS ,  
CAS and WE control. This common I/O feature dictates the use of  
early-write cycles to prevent contention of Data In and Data Out.  
Since the Write-Enable (WE) signal must always go low before CAS  
in a write cycle, Read-Write and Read-Modify-Write operation is not  
possible.  
FEATURES  
· 4,194,304 x 8 bit organization  
· Power  
· Low Profile 30 pad (SIM) Single In-Line Memory  
· Low Profile 30 pin (SIP) Single In-Line package  
· JEDEC standard pinout  
0.095 Watt Max Active, 70 nSEC  
1.060 Watt Max Active, 60 nSEC  
11.0 mWatt Max Standy  
· Operating free air temperature 00C to 700C  
· Common CAS and RAS control for eight common DQ Lines  
· CAS-before-RAS refresh  
· Downward compatible with AK581024 and AK58256  
· Upward compatible with AK5816384  
· Refresh cycle 2048 cycles in 32 mSEC  
· Fast Page Mode and Static Column Mode versions available,  
nibble mode is not possible  
PIN NOMENCLATURE  
PIN ASSIGNMENT  
FUNCTIONAL DIAGRAM  
A0 - A10  
RAS0  
CAS  
WE  
Address Inputs  
Row Address Strobe  
Column Address Strobe  
Write Enable  
1
2
Vcc  
CAS  
DQ1  
A0  
16  
DQ5  
A8  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
3
A9  
4
A10  
DQ6  
WE  
Vss  
DQ7  
NC  
5
A1  
OE  
Output Enable  
Data In/Data Out  
5v Supply  
6
DQ2  
A2  
DQ1 - DQ8  
Vcc  
7
8
A3  
9
Vss  
DQ3  
A4  
Vss  
Ground  
10  
11  
12  
13  
14  
15  
DQ8  
NC  
NC  
No Connect  
A5  
RAS0  
NC  
DQ4  
A6  
MODULE OPTIONS  
NC  
A7  
Vcc  
Leadless SIM: AK584096BS  
Leaded SIP: AK584096BG  

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