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AK2363 PDF预览

AK2363

更新时间: 2024-01-22 02:39:06
品牌 Logo 应用领域
AKM 电信信令电路电信电路无线
页数 文件大小 规格书
33页 484K
描述
Radio Signaling LSI

AK2363 技术参数

生命周期:Active零件包装代码:QFN
包装说明:,针数:24
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.68电源:3 V
认证状态:Not Qualified子类别:Other Telecom ICs
Base Number Matches:1

AK2363 数据手册

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ASAHI KASEI  
[AK2363]  
AK2363  
Radio Signaling LSI  
Features  
□ DTMF Receiver including an AGC circuit  
□ Built-in MSK modem allowing selection from 1200 and 2400 bit/s  
□ Programmable modem frame detection pattern  
□ Built-in 3.6864MHz oscillator circuit  
□ Support of external clocks with frequencies twice, three times, and four times  
higher than 3.6864MHz  
□ Operating voltage range: 2.6V to 3.7V  
□ Operating temperature range: -40°C to +85°C  
□ Package: 24-pin QFNJ (4.0 x 4.0 x 0.75mm, 0.5mm pitch)  
Overview  
The AK2363 is a radio signaling LSI device into which an MSK modem and a DTMF Receiver are  
integrated on a single chip.  
The MSK modem supports 1200 and 2400 bit/s, and the demodulator has a 16-bit frame pattern  
detection function that allows any settings. When the signal-to-noise (S/N) ratio is 12dB, the BER  
characteristic at 1200 bit/s is 5.0E-06, and the BER characteristic at 2400 bit/s is 1.0E-04.  
The DTMF Receiver operates in two modes: Normal mode (AGD Disable) indicating input signal  
detection levels ranging from -27dBx to 0dBx and high sensitivity mode (AGC Enable) in which the  
receiver operates at –40dBx to 0dBx.  
In addition to a fundamental frequency of 3.686MHz, the oscillator circuit supports external clock input  
with frequencies of 7.3728MHz (twice higher than 3.6864MHz), 11.0592MHz (three times higher than  
3.6864MHz), and 14.7456MHz (four times higher than 3.6864MHz).  
The internal operation is controlled by the three-wire serial method in which serial input data (SDATA)  
consisting of a 1-bit instruction, a 4-bit address, and 8-bit data is set in synchronization with the CSN  
and SCLK signals.  
The 24-pin QFNJ package (4.0mm ´ 4.0mm) is employed to realize compact, high-density packaging.  
MS0583-E-01  
2008/06  
- 1 -  

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