AGN3AB thru AGN3MB
Surface Mount Glass Passivated Standard Rectifier
Reverse Voltage 50~1000V Forward Current 3A
Features
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
• For surface mounted applications
• Low profile package
• Buili-in strain relief,ideal for automated placement
• Glass passivated chip junction
• For use of general purpose rectification
• AEC-Q101 qualified
Mechanical Data
• Case: JEDEC DO-214AA(SMB) molded plastic body over glass passivated chip
• Terminals: Solder plated,solderable per MIL-STD-750,Method 2026
• High temperature soldering: 260℃,10 seconds at terminals
• Polarity: Color band denotes cathode end
• Weight:0.003 ounce,0.093gram
Maximum Ratings and Electrical Characteristics
(TA = 25 °C unless otherwise noted)
AGN3AB AGN3BB AGN3DB AGN3GB AGN3JB AGN3KB AGN3MB
Parameter
Test Conditions
Symbol
Unit
Maximum repetitive peak reverse voltage
Maximum RMS voltage
50
35
50
100
70
200
140
200
400
280
400
600
420
600
800
560
800
1000
700
V
V
V
VRRM
VRMS
VDC
Maximum DC blocking voltage
100
1000
Maximum average forward rectified current at
TL(See Fig.1)
3.0
A
A
IF(AV)
IFSM
Peak forward surge current 8.3 ms single half
sine-wave superimposed on rated load
100
42
A2S
A
I2t
Rating for fusing (t<8.3ms,single half sine-wave )
Peak forward surge current 1 ms single square
wave superimposed on rated load
220
IFSM
A2S
I2t
48.4
1.15
Rating for fusing(t<1ms,single square wave )
Maximum instantaneous
3.0A
VF
Volts
forward voltage
TA=25℃
10.0
250
Maximum DC reverse current
at rated DC blocking voltage
µA
IR
TA=125℃
Maxinmum reverse recovery IF=0.5A,IR=1.0A,
3.0
uS
trr
time at
Irr=0.25A
47
13
juntion to ambient
juntion to lead
RθJA
RθJL
Typical thermal resistance1)
℃/W
22
pF
°C
CJ
Typical junction capacitance 4.0 V, 1 MHz
- 55 to + 150
Operating junction and storage temperature range
TJ, TSTG
Note:1),The thermal resistance from junction to ambient,case or lead,mounted on P.C.B with 8.0×8.0mm copper pads
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2019.07-Rev.B