Advance v0.4
®
IGLOO nano Low-Power Flash FPGAs
with Flash*Freeze Technology
Advanced I/Os
Features and Benefits
• 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
• Bank-Selectable I/O Voltages—up to 4 Banks per Chip
• Single-Ended I/O Standards: LVTTL, LVCMOS
3.3 V / 2.5 V / 1.8 V / 1.5 V / 1.2 V
Low Power
• nanoPower Consumption—Industry’s Lowest Power
• 1.2 V to 1.5 V Core Voltage Support for Low Power
• Supports Single-Voltage System Operation
• Low-Power Active FPGA Operation
• Flash*Freeze Technology Enables Ultra-Low Power
Consumption while Maintaining FPGA Content
• Easy Entry to / Exit from Ultra-Low-Power Flash*Freeze
Mode
• Wide Range Power Supply Voltage Support per JESD8-B,
Allowing I/Os to Operate from 2.7 V to 3.6 V
• Wide Range Power Supply Voltage Support per JESD8-12,
Allowing I/Os to Operate from 1.14 V to 1.575 V
• I/O Registers on Input, Output, and Enable Paths
• Selectable Schmitt Trigger Inputs
• Hot-Swappable and Cold-Sparing I/Os
Small Footprint Packages
• Programmable Output Slew Rate and Drive Strength
• Weak Pull-Up/-Down
• As Small as 3x3 mm in Size
Wide Range of Features
• 10 k to 250 k System Gates
• Up to 36 kbits of True Dual-Port SRAM
• Up to 71 User I/Os
• IEEE 1149.1 (JTAG) Boundary Scan Test
• Pin-Compatible Packages across the IGLOO Family
Clock Conditioning Circuit (CCC) and PLL†
• Up to Six CCC Blocks, One with an Integrated PLL
• Configurable Phase Shift, Multiply/Divide, Delay
Capabilities, and External Feedback
Reprogrammable Flash Technology
• 130-nm, 7-Layer Metal, Flash-Based CMOS Process
• Live-at-Power-Up (LAPU) Level 0 Support
• Single-Chip Solution
• Wide Input Frequency Range (1.5 MHz up to 250 MHz)
Embedded Memory
• Retains Programmed Design When Powered Off
• 1 kbit of FlashROM User Nonvolatile Memory
• SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM
In-System Programming (ISP) and Security
• Secure ISP Using On-Chip 128-Bit Advanced Encryption
Standard (AES) Decryption via JTAG (IEEE 1532–compliant)
†
Blocks (×1, ×2, ×4, ×9, and ×18 organizations)
†
®
• True Dual-Port SRAM (except × 18 organization)
to Secure FPGA Contents
H•ighFla-PsheLrofcokrmance Routing Hierarchy
Enhanced Commercial Temperature Range
• –20°C to +70°C
• Segmented, Hierarchical Routing and Clock Structure
IGLOO nano Devices
1
IGLOO nano Devices
AGLN010 AGLN015 AGLN020
AGLN030
AGLN060
60 k
512
1,536
10
AGLN125
125 k
1,024
3,072
16
AGLN250
250 k
2,048
6,144
24
System Gates
10 k
86
260
2
15 k
128
384
4
20 k
172
520
4
30 k
256
768
5
Typical Equivalent Macrocells
VersaTiles (D-flip-flops)
Flash*Freeze Mode (typical, µW)
2
RAM kbits (1,024 bits)
–
–
–
–
18
36
36
2
4,608-Bit Blocks
–
–
–
–
4
8
8
FlashROM Bits
1 k
–
1 k
–
1 k
–
1 k
–
1 k
Yes
1
1 k
1 k
2
Secure (AES) ISP
Yes
1
Yes
1
2
Integrated PLL in CCCs
–
–
–
–
3
VersaNet Globals
4
4
4
6
18
18
18
I/O Banks
2
3
3
2
2
2
4
Maximum User I/Os
34
34
49
–
52
52
81
83
71
71
68
Maximum User I/Os (Known Good Die)
71
71
68
Package Pins
UC/CS
QFN
UC36
QN48
UC81, CS81 UC81, CS81
CS81
QN100
VQ100
CS81
QN100
VQ100
CS81
QN100
VQ100
QN68
QN68
QN48, QN68
VQ100
VQFP
Notes:
1. AGLN030 is available in the Z feature grade only and offers package compatibility with the lower density nano devices. Refer
to "IGLOO nano Ordering Information" on page III.
2. AGLN060, AGLN125, and AGLN250 in the CS81 package do not support PLLs. AGLN030 and smaller devices do not support this
feature.
3. Six chip (main) and three quadrant global networks are available for AGLN060 and above.
4. For higher densities and support of additional features, refer to the IGLOO and IGLOOe handbooks.
† AGLN030 and smaller devices do not support this feature.
December 2008
I
© 2008 Actel Corporation