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HMMC-2006 PDF预览

HMMC-2006

更新时间: 2024-01-11 03:30:08
品牌 Logo 应用领域
安捷伦 - AGILENT 射频和微波开关射频开关微波开关光电二极管
页数 文件大小 规格书
6页 90K
描述
DC-6 GHz Unterminated SPDT Switch

HMMC-2006 技术参数

生命周期:Transferred包装说明:DIE OR CHIP
Reach Compliance Code:unknown风险等级:5.2
Is Samacsys:N特性阻抗:50 Ω
构造:COMPONENT最大输入功率 (CW):30 dBm
最大插入损耗:1.2 dB功能数量:1
最大工作频率:6000 MHz最小工作频率:
最高工作温度:125 °C最低工作温度:-55 °C
封装等效代码:DIE OR CHIP端口终止:REFLECTIVE
电源:-10 V射频/微波设备类型:SPDT
子类别:RF/Microwave Switches技术:GAAS
Base Number Matches:1

HMMC-2006 数据手册

 浏览型号HMMC-2006的Datasheet PDF文件第2页浏览型号HMMC-2006的Datasheet PDF文件第3页浏览型号HMMC-2006的Datasheet PDF文件第4页浏览型号HMMC-2006的Datasheet PDF文件第5页浏览型号HMMC-2006的Datasheet PDF文件第6页 
DC– 6 GHz Unterminated SPDT  
Switch  
Technical Data  
HMMC-2006  
Features  
• Frequency Range: DC-6 GHz  
SEL1  
SEL2  
• Insertion Loss:  
<1dB@6GHz  
RF  
OUT2  
RF  
OUT1  
• Isolation:  
>70dB@45MHz  
>35dB@6GHz  
• ReturnLoss:>12dB  
(Both Input & Output)  
• SwitchingSpeed:<1ns  
• P-1dB  
:
23dBm@50MHz  
>27dBm@6GHz  
• Harmonics:<-25dBc@  
Chip ID  
20 dBm(DCcoupled)  
RF  
IN  
Description  
The HMMC-2006 is a GaAs  
Chip Size:  
Chip Size Tolerance:  
Chip Thickness:  
960x1070µm(37.8x42.1mils)  
+0,-10µm(+0,-0.4mils)  
127± 15µm(5.0± 0.6mils)  
monolithic microwave integrated  
circuit (MMIC) designed for low  
insertion loss and high isolation  
from DC to 6 GHz. It is intended  
for use as a general-purpose,  
singlepole, double-throw (SPDT)  
switch. One series and two shunt  
MESFETs per throw provide  
1.2 dBmaximuminsertionloss  
and 35 dB minimum isolation at  
6 GHz.HMMC-2006chipsuse  
through-substrate vias to provide  
ground connections to the chip  
backside and minimize the  
Pad Dimensions:  
80 x 80 µm (3.2 x 3.2 mils), or larger  
Absolute Maximum Ratings[1]  
Symbol  
Parameters/Conditions  
Select Voltages 1 and 2  
RF Input Power  
Units  
V
Min.  
Max.  
+3  
Vsel  
-12  
Pin  
dBm  
°C  
30  
Top  
Operating Temperature  
Storage Temperature  
-55  
-65  
+125  
+165  
TSTG  
°C  
Maximum Assembly Temp.  
(for 60 seconds max.)  
number of wire bonds required.  
The HMMC-2006 is also available  
inan8-leadflatpack(1GG7-4201).  
Tmax  
°C  
+300  
Note:  
1. Operation in excess of any one of these conditions may result in permanent  
damage to this device. TA = 25°C except for Tch, TSTG, and Tmax  
.
7-20  
5965-9071E  

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