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AMMP-6530-TR1

更新时间： 2024-01-05 14:47:47

品牌	Logo	应用领域
安捷伦 - AGILENT		射频和微波射频混频器微波混频器
页数	文件大小	规格书
10页	255K
描述
5-30 GHz Image Reject Mixer

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技术参数
数据手册

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AMMP-6530-TR1 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
包装说明：	LCC8,.2SQ,28	Reach Compliance Code：	compliant
ECCN代码：	EAR99	HTS代码：	8542.39.00.01
风险等级：	5.82	特性阻抗：	50 Ω
构造：	COMPONENT	最大变频损耗：	8 dB
最大输入功率 (CW)：	25 dBm	安装特点：	SURFACE MOUNT
端子数量：	8	最大工作频率：	30000 MHz
最小工作频率：	5000 MHz	封装主体材料：	PLASTIC/EPOXY
封装等效代码：	LCC8,.2SQ,28	射频/微波设备类型：	IMAGE REJECTION
子类别：	RF/Microwave Mixers	表面贴装：	YES

AMMP-6530-TR1 数据手册

Agilent AMMP-6530

5–30 GHz Image Reject Mixer

Data Sheet

Features

• 5x5 mm Surface Mount Package

• Broad Band Performance 5–30 GHz

• Low Conversion Loss of 8 dB

• High Image Rejection of 15–20 dB

• Good 3rd Order Intercept of

+18 dBm

Description

• Single -1V, no current Supply Bias

Agilent’s AMMP-6530 is an image

reject mixer that operates from

5 GHz to 30 GHz. The cold

IF1

IF2

Applications

• Microwave Radio Systems

channel FET mixer is designed to

be an easy-to-use component for

any surface mount PCB applica-

tion. It can be used drain pumped

for low conversion loss applica-

tions, or when gate pumped the

mixer can provide high linearity

for SSB up-conversion. An

external 90-degree hybrid is used

to achieve image rejection and a

-1V voltage reference is needed.

Intended applications include

microwave radios, 802.16, VSAT,

and satellite receivers. Since this

one mixer can cover several

bands, the AMMP-6530 can

• Satellite VSAT, DBS Up/Down Link

• LMDS & Pt-Pt mmW Long Haul

• Broadband Wireless Access

(including 802.16 and 802.20

WiMax)

gate

Top view

package base: GND

Function

• WLL and MMDS loops

IF1

• Commercial grade military

IF2

reduce part inventory. The

Absolute Maximum Ratings^[1]

integrated mixer eliminates

complex tuning and assembly

processes typically required by

hybrid (discrete-FET or diode)

mixers. The package is fully SMT

compatible with backside ground-

ing and I/O to simplify assembly.

Symbol

Parameters/Conditions

Units

Min.

Max.

V_g

Gate Supply Voltage

-3

P_in

CW Input Power

dBm

°C

T_ch

Operating Channel Temperature

Storage Case Temperature

Max. Assembly Temp (60 sec max)

+150

+300

T_stg

T_max

Note:

°C

-65

°C

1. Operation in excess of any one of these conditions may result in permanent damage to this device.

Attention: Observe precautions for handling electrostatic sensitive devices.

ESD Machine Model (Class A)

ESD Human Body Model (Class 0)

Refer to Agilent Application Note A004R: Electrostatic Discharge Damage and Control.

12 3 4 5 6 7...10

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