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ADA-4743-BLK PDF预览

ADA-4743-BLK

更新时间: 2024-11-04 03:17:47
品牌 Logo 应用领域
安捷伦 - AGILENT 射频和微波射频放大器微波放大器
页数 文件大小 规格书
9页 108K
描述
Silicon Bipolar Darlington Amplifier

ADA-4743-BLK 技术参数

是否Rohs认证:不符合生命周期:Obsolete
包装说明:SOT-343RReach Compliance Code:unknown
风险等级:5.09Is Samacsys:N
特性阻抗:50 Ω构造:COMPONENT
增益:15 dB最大输入功率 (CW):20 dBm
JESD-609代码:e0功能数量:1
最大工作频率:2500 MHz最小工作频率:
封装主体材料:PLASTIC/EPOXY封装等效代码:SOT-343R
电源:3.8 V射频/微波设备类型:WIDE BAND LOW POWER
子类别:RF/Microwave Amplifiers技术:BIPOLAR
端子面层:Tin/Lead (Sn/Pb)最大电压驻波比:1.5
Base Number Matches:1

ADA-4743-BLK 数据手册

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Agilent ADA-4743  
Silicon Bipolar Darlington Amplifier  
Data Sheet  
Features  
• Small Signal gain amplifier  
• Operating frequency DC – 2.5 GHz  
• Unconditionally stable  
Surface Mount Package  
Description  
• 50 Ohms input & output  
Agilent Technologies’ ADA-4743  
is an economical, easy-to-use,  
general purpose silicon bipolar  
RFIC gain block amplifiers  
housed in a 4-lead SC-70  
(SOT-343) surface mount plastic  
package which requires only half  
the board space of a SOT-143  
package.  
SOT-343  
• Flat, Broadband Frequency  
Response up to 1 GHz  
• Operating Current: 40 to 80 mA  
• Industry standard SOT-343 package  
• Lead-free option available  
Specifications  
900 MHz, 3.8V, 60 mA (typ.)  
Pin Connections and  
Package Marking  
The Darlington feedback struc-  
ture provides inherent broad  
bandwidth performance, result-  
ing in useful operating frequency  
up to 2.5 GHz. This is an ideal  
device for small-signal gain  
• 16.5 dB associated gain  
RFout  
& Vd  
• 17.1 dBm P1dB  
GND  
• 32.6 dBm OIP3  
• 4.2 dB noise figure  
GND  
RFin  
• VSWR < 2 throughput operating  
cascades or IF amplification.  
frequency  
Note:  
Top View. Package marking provides orientation  
and identification.  
• Single supply, typical Id = 60 mA  
ADA-4743 is fabricated using  
Agilent’s HP25 silicon bipolar  
process, which employs a double-  
diffused single polysilicon  
“3T” = Device Code  
“x” = Date code character  
identifies month of manufacture.  
Applications  
• Cellular/PCS/WLL base stations  
process with self-aligned  
• Wireless data/WLAN  
• Fiber-optic systems  
• ISM  
submicron emitter geometry. The  
process is capable of simulta-  
neous high fT and high NPN  
breakdown (25 GHz fT at 6V  
BVCEO). The process utilizes  
industry standard device oxide  
isolation technologies and  
submicron aluminum multilayer  
interconnect to achieve superior  
performance, high uniformity,  
and proven reliability.  
Typical Biasing Configuration  
VCC  
bypass  
= 5 V  
V
- V  
d
cc  
I
R
=
c
d
R
C
c
Attention:  
RFC  
Observe precautions for  
handling electrostatic  
sensitive devices.  
C
block  
RF  
input  
3Tx  
RF  
output  
V
= 3.8 V  
d
C
block  
ESD Machine Model (Class A)  
ESD Human Body Model (Class 1B)  
Refer to Agilent Application Note A004R:  
Electrostatic Discharge Damage and Control.  

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