是否无铅: | 含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | QFN |
包装说明: | HVQCCN, | 针数: | 40 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.56 |
Samacsys Confidence: | Samacsys Status: | Released | |
Schematic Symbol: | https://componentsearchengine.com/symbol.php?partID=572183 | PCB Footprint: | https://componentsearchengine.com/footprint.php?partID=572183 |
Samacsys PartID: | 572183 | Samacsys Image: | https://componentsearchengine.com/Images/9/AD8264ACPZ-RL.jpg |
Samacsys Thumbnail Image: | https://componentsearchengine.com/Thumbnails/1/AD8264ACPZ-RL.jpg | Samacsys Pin Count: | 41 |
Samacsys Part Category: | Integrated Circuit | Samacsys Package Category: | Other |
Samacsys Footprint Name: | QFN50P600X600X100-41N | Samacsys Released Date: | 2017-01-11 11:21:59 |
Is Samacsys: | N | 模拟集成电路 - 其他类型: | ANALOG CIRCUIT |
JESD-30 代码: | S-XQCC-N40 | JESD-609代码: | e3 |
长度: | 6 mm | 湿度敏感等级: | 1 |
负电源电压最大值(Vsup): | -5 V | 负电源电压最小值(Vsup): | -2.5 V |
标称负供电电压 (Vsup): | -3.3 V | 功能数量: | 1 |
端子数量: | 40 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | UNSPECIFIED |
封装代码: | HVQCCN | 封装形状: | SQUARE |
封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 峰值回流温度(摄氏度): | 260 |
认证状态: | Not Qualified | 座面最大高度: | 1 mm |
最大供电电压 (Vsup): | 5 V | 最小供电电压 (Vsup): | 2.5 V |
标称供电电压 (Vsup): | 3.3 V | 表面贴装: | YES |
温度等级: | INDUSTRIAL | 端子面层: | Matte Tin (Sn) |
端子形式: | NO LEAD | 端子节距: | 0.5 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | 30 |
宽度: | 6 mm | Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
AD8264-EVALZ | ADI | Quad, 235 MHz, DC-Coupled VGA and Differential Output Amplifier |
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AD826AN | ADI | High-Speed, Low-Power Dual Operational Amplifier |
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AD826ANZ | ADI | High-Speed, Low-Power Dual Operational Amplifier |
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AD826AR | ADI | High-Speed, Low-Power Dual Operational Amplifier |
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AD826AR-REEL | ADI | High-Speed, Low-Power Dual Operational Amplifier |
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AD826AR-REEL7 | ADI | High-Speed, Low-Power Dual Operational Amplifier |
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