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ADUM3100ARWZ

更新时间： 2024-02-29 10:10:48

品牌	Logo	应用领域
亚德诺 - ADI		/
页数	文件大小	规格书
8页	253K
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ESD/Latch-Up Considerations with iCouplerÂ® Isolation Products

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ADUM3100ARWZ 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Active	零件包装代码：	SOIC
包装说明：	SOP,	针数：	8
Reach Compliance Code：	unknown	风险等级：	5.58
Is Samacsys：	N	其他特性：	ALSO OPERATES AT 5V NOMINAL
模拟集成电路 - 其他类型：	ANALOG CIRCUIT	JESD-30 代码：	R-PDSO-G8
JESD-609代码：	e3	长度：	4.9 mm
湿度敏感等级：	1	功能数量：	1
端子数量：	8	最高工作温度：	105 °C
最低工作温度：	-40 °C	封装主体材料：	PLASTIC/EPOXY
封装代码：	SOP	封装形状：	RECTANGULAR
封装形式：	SMALL OUTLINE	峰值回流温度（摄氏度）：	260
座面最大高度：	1.75 mm	最大供电电压 (Vsup)：	5.5 V
最小供电电压 (Vsup)：	3 V	标称供电电压 (Vsup)：	3.3 V
表面贴装：	YES	技术：	CMOS
温度等级：	INDUSTRIAL	端子面层：	MATTE TIN
端子形式：	GULL WING	端子节距：	1.27 mm
端子位置：	DUAL	处于峰值回流温度下的最长时间：	40
宽度：	3.9 mm	Base Number Matches：	1

ADUM3100ARWZ 数据手册

AN-793

APPLICATION NOTE

One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106 • Tel: 781/329-4700 • Fax: 781/461-3113 • www.analog.com

ESD/Latch-Up Considerations with iCoupler Isolation Products

by Rich Ghiorse

INTRODUCTION

Components vs. Systems

Analog Devices iCoupler products offer an alternative iso-

lation solution to optocouplers with superior integration,

performance, and power consumption characteristics. An

iCoupler isolation channel consists of CMOS input and

output circuits and a chip scale transformer (see Figure 1).

Because the iCoupler employs CMOS technology, it can

be more vulnerable to latch-up or electrostatic discharge

(ESD) damage than an optocoupler when subjected to

system-level ESD, surge voltage, fast transient, or other

overvoltage conditions.

Simply put, a component is a single integrated device

with interconnects while a system is a nonintegrated

device built from several interconnected components. In

almost all cases the distinction between a component

and a system is obvious. However, the differences

between component and system tests may not be

so obvious. Further, component specifications may

not directly indicate how a device will perform in

system-level testing. ESD testing is a good example

of this.

ESD, surge, burst, and fast transient events are facts of

life in electronic applications. These events generally

consist of high voltage, short duration spikes applied

directly or indirectly to a device. These events arise

from interaction of the device to real-world phenomena,

such as human contact, ac line perturbations, lightning

strikes, or common-mode voltage differences between

system grounds.

Component-level ESD testing is most useful in deter-

mining a device’s robustness to handling by humans

and automated assembly equipment prior and during

assembly into a system. Component-level ESD data is

less useful in determining a device’s robustness within

a system subjected to system-level ESD events. There

are two reasons for this.

Figure 1. ADuM140x Quad Isolator

This application note provides guidance for avoiding

these problems. Examples are presented for various

system-level test conﬁgurations showing mechanisms

that may impact performance. For each example recom-

mended solutions are given.

•

System- and component-level ESD testing have

different objectives. Component-level testing seeks

to address conditions typically endured during com-

ponent handling and assembly. System-level testing

seeks to address conditions typically endured during

system operation.

Later this year, Analog Devices is introducing hardened

versions of most iCoupler products that will have

improved immunity to latch-up and electrical overstress

(EOS). This new product family, the ADuM3xxx series,

will be pin-compatible with the existing ADuM1xxx

series products and will offer identical performance

speciﬁcations. Both product families will continue to

be made available.

•

The speciﬁc conditions a component is subjected

to during system-level testing can be a strong func-

tion of the board/module/system design in which it

resides. For example, long inductive traces between

a system and component ground can actually impose

a more severe voltage transient onto a component

than is imposed on the system at the test point.

REV.0

12 3 4 5 6 7 8

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