Source Url Status Check Date: | 2013-05-01 14:56:47.076 | 是否无铅: | 含铅 |
是否Rohs认证: | 符合 | 生命周期: | Active |
零件包装代码: | BGA | 包装说明: | VFBGA, |
针数: | 16 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.39.00.01 |
风险等级: | 1.56 | Samacsys Confidence: | |
Samacsys Status: | Released | Schematic Symbol: | https://componentsearchengine.com/symbol.php?partID=577691 |
PCB Footprint: | https://componentsearchengine.com/footprint.php?partID=577691 | Samacsys PartID: | 577691 |
Samacsys Image: | https://componentsearchengine.com/Images/9/ADP5585ACBZ-00-R7.jpg | Samacsys Thumbnail Image: | https://componentsearchengine.com/Thumbnails/1/ADP5585ACBZ-00-R7.jpg |
Samacsys Pin Count: | 16 | Samacsys Part Category: | Integrated Circuit |
Samacsys Package Category: | Other | Samacsys Footprint Name: | BGA16C40P4X4_159X159X54 |
Samacsys Released Date: | 2017-01-10 13:33:33 | Is Samacsys: | N |
JESD-30 代码: | S-PBGA-B16 | JESD-609代码: | e1 |
长度: | 1.59 mm | 湿度敏感等级: | 1 |
功能数量: | 1 | 端子数量: | 16 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | VFBGA |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 260 | 座面最大高度: | 0.545 mm |
标称供电电压: | 1.8 V | 表面贴装: | YES |
电信集成电路类型: | TELECOM CIRCUIT | 温度等级: | INDUSTRIAL |
端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) | 端子形式: | BALL |
端子节距: | 0.4 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 30 | 宽度: | 1.59 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
ADP5585ACBZ-01-R7 | ADI | Keypad Decoder and I/O Expansion |
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ADP5585ACBZ-02-R7 | ADI | Keypad Decoder and I/O Expansion |
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ADP5585ACBZ-04-R7 | ADI | Keypad Decoder and I/O Expansion |
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ADP5585ACPZ-00-R7 | ADI | Keypad Decoder and I/O Expansion |
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ADP5585ACPZ-01-R7 | ADI | Keypad Decoder and I/O Expansion |
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ADP5585ACPZ-03-R7 | ADI | Keypad Decoder and I/O Expansion |
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