ACT–F1M32 High Speed 32 Megabit
Boot Block
FLASH Multichip Module
CIRCUIT TECHNOLOGY
www.aeroflex.com/act1.htm
Features
■ 4 Low Voltage/Power Intel 1M x 8 FLASH Die in One
MCM Package
■ Single Block Erase (All bits set to 1)
■ Hardware Data Protection Feature
■ Independent Boot Block Locking
■ MIL-PRF-38534 Compliant MCMs Available
■ Packaging – Hermetic Ceramic
■ Overall Configuration is 1M x 32
■ +5V Operation (Standard) or +3.3V (Consult Factory)
■ Access Times of 80, 100 and 120 nS ( 5V VCC)
■ +5V or +12V Programing
● 68 Lead, .94" x .94" x .180" Dual-Cavity Small
Outline Gull Wing, Aeroflex code# "F14" (Drops into
the 68 Lead JEDEC .99"SQ CQFJ footprint)
■ Erase/Program Cycles
● 100,000 Commercial
● 10,000 Military and Industrial
■ Sector Architecture (Each Die)
■ Internal Decoupling Capacitors for Low Noise
Operation
■ Commercial, Industrial and Military Temperature
Ranges
● One 16K Protected Boot Block (Bottom Boot Block
Standard, Top Boot Block Special Order)
● Two 8K Parameter Blocks
● One 96K Main Block
● Seven 128K Main Blocks
Block Diagram – CQFP(F14)
General Description
Pin Description
Standard Configuration
I/O0-31
Data I/O
Utilizing Intel’s SmartVoltage
CE1
CE2
CE3
CE4
Boot Block Flash Memory
A0–19 Address Inputs
SmartDie™, the ACT–F1M32 is
a high speed, 32 megabit CMOS
flash multichip module (MCM)
designed for full temperature
range military, space, or high
reliability applications.
WP
WE
OE
WE
CE1-4
OE
Write Enables
Chip Enables
Output Enable
Write Protect
A0 – A19
RP
WP
1Mx8
1Mx8
1Mx8
1Mx8
RP Reset/Powerdown
The ACT-F1M32 consists of
four high-performance Intel
X28F800BV 8 Mbit (8,388,608
bit) memory die. Each die
contains separately erasable
blocks, including a hardware
lockable boot block (16,384
bytes), two parameter blocks
(8,192 bytes each), and 8 main
blocks (one block of 98,304
bytes and seven blocks of
131,072 bytes) This defines the
VCC
GND
NC
Power Supply
Ground
8
8
8
8
Not Connected
I/O0-7
I/O8-15
I/O16-23
I/O24-31
Block Diagram – CQFP(F14)
Pin Description
Optional Configuration
I/O0-31
Data I/O
WE1 CE1 WE2 CE2 WE3 CE3 WE4 CE4
A0–19 Address Inputs
RP
OE
A0 – A19
WE1-4
CE1-4
OE
Write Enable
Chip Enables
Output Enable
boot
block
flash
family
architecture.
1Mx8
1Mx8
1Mx8
1Mx8
RP Reset/Powerdown
The command register is
written by bringing WE to a logic
low level (VIL), while CE is low
and OE is high (VIH). Reading is
VCC
GND
NC
Power Supply
Ground
8
8
8
8
Not Connected
I/O0-7
I/O8-15
I/O16-23
I/O24-31
eroflex Circuit Technology - Advanced Multichip Modules © SCD1661B REV A 1/16/97