ACNV3130
2.5 Amp Output Current IGBT Gate Drive Optocoupler
in 500Mil DIP10 Package
Data Sheet
Description
Features
The ACNV3130 contains an AlGaAs LED, which is optical- 2.5 A maximum peak output current
ly coupled to an integrated circuit with a power output
stage. This optocoupler is ideally suited for driving power
IGBTs and MOSFETs used in motor control inverter appli-
2.0 A minimum peak output current
500 ns maximum propagation delay
cations. The high operating voltage range of the output 350 ns maximum propagation delay difference
stage provides the drive voltages required by gate con-
trolled devices. The voltage and high peak output current
supplied by this optocoupler can be used to drive a dis-
crete power stage make it ideally suited for direct driving
IGBT with ratings up to 1700V/100A. For IGBTs with higher
ratings, this optocoupler can be used to drive a discrete
40 kV/μs minimum Common Mode Rejection (CMR) at
= 1500 V
V
CM
I = 5.0 mA maximum supply current
CC
Under Voltage Lock-Out Protection (UVLO) with
Hysteresis
power stage which drives the IGBT gate. The ACNV3130 Wide Operating V Range: 15 to 30 V
CC
has the highest insulation voltage of VIORM= 2262 Vpeak
in the IEC/ EN/DIN EN 60747-5-5.
Industrial Temperature Range: -40°C to 105°C
Safety Approval Pending
Functional Diagram
-
-
-
UL Recognized 7500 V
CSA
for 1min.
RMS
1
2
3
4
5
NC
10
9
VCC
VOUT
NC
IEC/EN/DIN EN 60747-5-5 V
= 2262 Vpeak
IORM
Applications
ANODE
690Vac application
CATHODE
8
IGBT/MOSFET gate drive
AC and Brushless DC motor drives
Renewable energy inverters
Industrial inverters
NC
NC
VEE
NC
7
6
Switching power supplies
Design Note:
-
-
NC denotes not connected
A 0.1 ꢀF bypass capacitor must be connected between pins V and
CC
V
EE
Truth Table - ACNV3130
VCC – VEE
“POSITIVE GOING”
(i.e., TURN-ON)
VCC – VEE
“NEGATIVE GOING”
(i.e., TURN-OFF)
0 – 30 V
LED
OFF
ON
ON
ON
VO
LOW
0 - 30 V
0 – 11V
0 – 9.5V
LOW
11 - 13.5V
13.5 – 30V
9.5 – 12V
TRANSITION
HIGH
12 – 30V
CAUTION: It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.