ABS2005 thru ABS210
2.0 A Single-Phase Glass Passivated Bridge Rectifiers
ABS
A
+
-
~
~
Features
K
D
G
The plastic material used carries Underwriters Laboratory
flammability recognition 94V-0
E
F
I
Ideal for printed circuit board application
High temperature soldering guaranteed 260 C /5
seconds at 5 lbs (2.3kg) tension
ABS
Min
Dim
A
Max
5.20
4.60
1.50
6.65
0.35
4.80
4.30
1.20
6.15
0.15
B
C
D
E
Mechanical Data
F
G
H
I
0.30
0.90
Case: Molded plastic
0.20MAX
Terminals: Plated leads solderable per MIL-STD-202,Method 208
1.35
0.60
3.80
1.65
0.80
4.20
Polarity: Marked on body
Mounting Position: Any
K
All Dimensions in mm
Maximum Ratings & Thermal Characteristics
Rating at 25 C ambient temperature unless otherwise specified, Resistive or Inductive load, 60 Hz.
For Capacitive load derate current by 20%.
ABS
ABS
201
ABS
202
ABS
204
ABS
206
ABS
208
ABS
Parameter
Symbol
unit
2005
210
1000
700
V
VRRM
VRMS
VDC
Maximum repetitive peak reverse voltage
Maximum RMS bridge input voltage
Maximum DC blocking voltage
50
35
50
100
70
200
140
200
400
280
400
600
420
600
800
560
800
V
V
100
1000
Maximum average forward rectified
output current at TA=40 C
IF(AV)
2
A
Peak forward surge current single sine-wave
superimposed on rated load (JEDEC Method)
50
A
IFSM
2
2
I t
sec
A
Rating for fusing ( t<8.3ms)
15
25
C / W
Typical thermal resistance per element (1)
ReJA
TJ,
Operating junction and storage temperature
range
C
-55 to + 150
TSTG
Electrical Characteristics
Rating at 25 C ambient temperature unless otherwise specified. Resistive or Inductive load, 60Hz.
For Capacitive load derate by 20 %.
ABS
2005
ABS
201
ABS
202
ABS
204
ABS
206
ABS
208
ABS
210
Parameter
Symbol
Unit
Maximum instantaneous forward voltage drop
per leg at 2A
1.1
VF
V
10
500
Maximum DC reverse current at rated TA =25 C
A
IR
DC blocking voltage per element
Notes: (1)Thermal resistance from Junction to Ambemt on P.C.board mounting.
(2)Measured at 2.0MHz and applied reverse voltage of 4.0 volts.
TA =125 C
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mail:lge@lgesemi.com
Revision:20160808-P1