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A4987SLPTR-T PDF预览

A4987SLPTR-T

更新时间: 2024-01-02 05:02:18
品牌 Logo 应用领域
急速微 - ALLEGRO 驱动器
页数 文件大小 规格书
16页 441K
描述
DMOS Dual Full-Bridge PWM Motor Driver with Overcurrent Protection

A4987SLPTR-T 数据手册

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A4987  
DMOS Dual Full-Bridge PWM Motor Driver  
with Overcurrent Protection  
Features and Benefits  
Low RDS(ON) outputs  
Description  
The A4987 is a dual DMOS full-bridge stepper motor driver  
Internal mixed current decay mode  
Synchronous rectification for low power dissipation  
Internal UVLO  
withparallelinputcommunicationandovercurrentprotection.  
Eachfull-bridgeoutputisratedupto35Vand±1A.TheA4987  
includesfixedoff-timepulsewidthmodulation(PWM)current  
regulators,alongwith2-bitnonlinearDACs(digital-to-analog  
converters) that allow stepper motors to be controlled in full,  
half, and quarter steps. The PWM current regulator uses the  
Allegro® patented mixed decay mode for reduced audible  
motor noise, increased step accuracy, and reduced power  
dissipation.  
Crossover-current protection  
3.3 and 5 V compatible logic supply  
Thin profile QFN and TSSOP packages  
Thermal shutdown circuitry  
Short-to-ground protection  
Shorted load protection  
Low current Sleep mode, < 10 μA  
Internalsynchronousrectificationcontrolcircuitryisprovided  
to improve power dissipation during PWM operation.  
The outputs are protected from shorted load and short-to-  
groundevents,whichprotectthedriverandassociatedcircuitry  
from thermal damage or flare-ups. Other protection features  
includethermalshutdownwithhysteresis,undervoltagelockout  
(UVLO) and crossover current protection. Special power-up  
sequencing is not required.  
Packages:  
Approximate size  
24-contact QFN  
with exposed thermal pad  
4 mm × 4 mm × 0.75 mm  
(ES package)  
TheA4987issuppliedintwopackages,a24-contactQFN(ES)  
anda24-pinTSSOP(LP).Bothpackageshaveexposedthermal  
pads for enhanced thermal performance. The 24-contact ES is  
4 mm × 4 mm, with a nominal overall package height of 0.75  
mm. The 24-pin LP is a TSSOP with 0.65 pitch and an overall  
package height of 1.2 mm. Both packages are lead (Pb) free,  
with 100% matte tin leadframe plating.  
24-pin TSSOP  
with exposed thermal pad  
(LP Package)  
Typical Application Diagram  
VDD  
0.1 μF  
0.1 μF  
0.22 μF  
VREG ROSC CP1  
VDD  
CP2 VCP  
VBB1  
VBB2  
0.22 μF  
100 μF  
Microcontroller or  
Controller Logic  
OUT1A  
SLEEP  
IN01  
A4987  
OUT1B  
SENSE1  
IN02  
PH1  
IN11  
IN12  
PH2  
OUT2A  
OUT2B  
SENSE2  
VREF  
GND  
GND  
4987-DS  

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